News Archive 2012

EV Group Completes Cleanroom Expansion, Opens New R&D Labs and Customer Training Center at Corporate Headquarters

2012_11EVGCleanroomNew  ST. FLORIAN, Austria, November 27, 2012 - EV Group (EVG) announced the completion of its newly expanded cleanroom IV facility at its corporate headquarters in Austria.  As part of the company's long-term growth strategy to address high-volume tool orders and speed time to market for its worldwide customer base, EV Group doubled its cleanroom space for process development and pilot production services.

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Texas State University Selects EV Group Wafer Bonding System for Advanced Compound Semiconductor and Silicon-Based Power Device Research

2012_11EVG501  ST. FLORIAN, Austria and SAN MARCOS, Texas, U.S., November 13, 2012 - EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced it has installed an EVG501 wafer bonding system to Texas State University.  The highly flexible R&D system, which is configurable for a variety of wafer bonding processes, has been installed in the university's cleanroom facilities to support advanced compound semiconductor and silicon-based power device research and development.

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EV Group Commands Leadership Position in MEMS Market

  2012_11openhouse  TEMPE, Ariz., November 6, 2012 - EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today highlighted a succession of milestones in the MEMS arena, where the company continues to strengthen its market share.  In 2012, MEMS represented 48 percent of the company's North American sales, up 13 percent from 2011, thanks to strong growth in the mobile device and automotive sensor markets.

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China-based SOI Wafer manufacturer Shenyang Silicon Technology purchases EV Group's EVG850LT 300-mm SOI Production Bonding System

2011_11_EVG850SOI   ST. FLORIAN, Austria, October 9, 2012—EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced that Shenyang Silicon Technology Co. Ltd. (SST) has successfully installed an EVG850LT 300-mm, lowtemperature automated production bonding system for silicon-on-insulator (SOI) materials. The China-U.S. joint-venture SOI wafer provider selected the 300-mm bonder as a follow-on to its prior purchase of a 200-mm EVG850LT. The system has already shipped to SST’s state-of-the-art facility, marking the first installation in China of a 300-mm SOI wafer production tool.

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How EV Group jumped to 4th place

vlsiresearchlogo   SANTA CLARA, CA, October 8, 2012 - 2012 was the first time EV Group (EVG), a wafer bonding and lithography equipment supplier, captured a top five spot in VLSIresearch's 2012 Customer Satisfaction Survey. This was a significant accomplishment because EVG has been growing by leaps and bounds with a combination of excellent products and the fast-growing MEMS and 3D IC semiconductor markets. EVG grew not only in revenues, but they also doubled their production capacity. 

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EV Group's ZoneBOND® Temporary Bonding/Debonding Technology Makes First Foray Into Compound Semiconductor Market

2011_10_ZoneBOND  ST. FLORIAN, Austria, September 24, 2012 - EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced it has received an order for its EVG850 temporary bonding/debonding (TB/DB) systems from a leading maker of compound semiconductor-based components. 

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EV Group, 대량생산을 위한 Coating/Developing에 적합한 차세대 EVG150 자동화 레지스트 프로세싱 플랫폼 설비 발표

2012_09EVG150preview   

2012 9 5 , 타이페이 , SEMICON Taiwan MEMS, 나노기술  반도체 시장의 세계적인 웨이퍼 본딩 및 리소그래피 장비 제조업체인 EV Group(EVG) 은 차세대 EVG150 자동화 레지스터 프로세싱 시스템모델을 발표했다 . 이 양산용 Coater&Developer 는 고객의 보다 다양한 필요를 충족 시키기 위해 완전히 새롭게 디자인 되었고 , Spin Coating Develop 기술력과 EVG 만의 최첨단 특허 기술인 Spray Coating 기술력이 통합되어 유연성이 높은 모듈 플랫폼 형태로 적용 되었다 .


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EV Group's GEMINI® Wafer Bonding System First to Pass Equipment Maturity Assessment within SEMATECH's 3D Interconnect and Manufacturability Program

2012_07_10Sematech  SEMICON WEST, San Francisco, Calif., July 10, 2012 - EV Group (EVG) today announced that its GEMINI® Automated Wafer Bonding System has become the first product to pass a systematic, rigorous Equipment Maturity Assessment (EMA) implemented within SEMATECH's 3D Interconnect program and ISMI's EMA team.

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EV Group and Brisbane Materials Technology Introduce Breakthrough Anti-Reflective Coating Solution to Boost Power Output of Photovoltaics

2012_07_09brismat    INTERSOLAR NORTH AMERICA, San Francisco, Calif., July 9, 2012 - EV Group (EVG), a leading supplier of coating equipment for the photovoltaics (PV), nanotechnology and semiconductor markets, and Brisbane Materials Technology (BMT), a specialty materials company, today announced they are collaborating to provide a total solution for anti-reflective (AR) coatings for the PV market.

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EV Group은 - 양산용 3D IC용 Temporary Bonding과 Debonding장비 출시

   thumbnail_overview_EVG850TBDB-(XT-Frame)-bg  2012 7 3 , 오스트리아 , ST.FLORIAN – MEMS, 나노 기술과 반도체 시장의 웨이퍼 본딩과 리소그래피 장비 제조업체인 EV Group(EVG) 자사의 새로운 XT 프레임 플랫폼을 기반으로 EVG ® 850TB/DB 자동화 Temporary bonding De-bonding 시스템을 출시했다고 발표했다 . XT 프레임 플랫폼은   3D IC TSV (through silicon via) 제조를 위해 Thin-wafer 공정 지원을 위해 최적화된 . 양산용용 새로운 XT 프레임 (XT Frame) 플랫폼으로 전환 하였다 . 하드웨어와 소프트웨어 디자인 향상으로 기존 EVG 제품 모델의 2 배가 넘는 공정 생산성 (Throughput) 현장 기준으로 시간당 40 회의 스택가 넘는 접합을 가능하게 하였다  

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A*Star Institute of Microelectronics Announces MEMS Consortium Phase II to Pave the Way for High Volume Manufacturing

  2012_06_ime  A*STAR Institute of Microelectronics (IME) has announced the launch of its Micro-Electro-Mechanical-Systems (MEMS) Consortium Phase II, to accelerate MEMS technology into markets driven by strong demand for next generation mobile devices.

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EV Group Receives First-ever Ranking Among Top Five VLSIresearch 10 BEST Suppliers of Chip Making Equipment

2012_05_vlsi  ST. FLORIAN, AUSTRIA, May 24, 2012 - EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced that for the first time, its customers have ranked EVG as one of VLSIresearch's top five 10 BEST Focused Suppliers of Chip Making Equipment companies in the market research firm's extensive customer satisfaction survey results for 2012. 

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Himax Technologies Selects EV Group to Expand Production Capacity for Wafer-Level Optics

thumbnail_overview_IQ_Aligner  ST. FLORIAN, AUSTRIA, March 27, 2012 - EV Group (EVG) today announced that Himax Technologies, Inc., a leading producer of CMOS image sensors, power management devices and semiconductor devices and components used in flat panel displays, has placed a repeat order for an IQ Aligner UV nanoimprint lithography (UV-NIL) system from EVG. 

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Shin-Etsu MicroSi Joins EV Group's Open Platform for Temporary Bonding Materials for 3D IC Manufacturing

   2012_03_ZoneBondOpenPlatform  ST. FLORIAN, Austria and TOKYO, Japan, March 14, 2012 - EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced that Shin-Etsu Chemical Co., Ltd., the world's largest supplier of semiconductor materials, has joined EVG's open platform for temporary bonding/debonding (TB/DB) materials.

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Tokyo Institute of Technology Installs EV Group Wafer Cleaning System for Advanced Optical IC Research and Development

  2012_03_EVG301_200mm  TOKYO, Japan, March 1, 2012 - EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced that it has shipped an EVG301 semi-automated single-wafer cleaning system to Tokyo Institute of Technology (Tokyo Tech).  The EVG301 has already been installed at Tokyo Tech's Arai-Nishiyama Lab, and is being used in the research and development of advanced optical communication ICs. 

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EV Group Launches Second-Generation EVG620HBL Mask Alignment System for LED Manufacturing

overview_EVG620HBLGenIIschwarz    STRATEGIES IN LIGHT, Santa Clara, Calif., February 7, 2012 – EV Group (EVG), a leading supplier of wafer-bonding and lithography equipment for the advanced semiconductor and packaging, compound semiconductors, MEMS, silicon-on-insulator (SOI) and emerging nanotechnology markets, today announced the EVG620HBL Gen II—the second generation fully automated mask alignment system for volume manufacturing of high-brightness light-emitting diodes (HB-LEDs).

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EV Group Signs Collaboration Agreement with Eulitha to Establish Low-Cost-of-Ownership Nanopatterning Solutions for HB-LED Manufacturing

EVG_EulithaPHABLEpreview  ST. FLORIAN, Austria, January 10, 2012 - EV Group (EVG) today announced that it has signed a joint-development and licensing agreement with Eulitha AG, a pioneer and leader in the production of high-quality nanostructures using advanced lithography techniques.  EVG will integrate Eulitha's PHABLE™ mask-based ultraviolet (UV) photolithography technology with EVG's automated mask aligner product platform.

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