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EV Group Scales Up Nanoimprint Lithography for Display Manufacturing  

EVG7200_LA_cleanroom_thumbnailST. FLORIAN, Austria, March 14, 2016 - EV Group (EVG) today introduced the EVG®7200 LA SmartNIL™ system for display manufacturing and other applications that require large-area substrates. Leveraging EVG's proprietary SmartNIL technology, the automated UV nanoimprint lithography (UV-NIL) system enables cost-efficient nano-patterning in high-volume manufacturing (HVM) applications.

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JOANNEUM RESEARCH and EV Group Jointly Develop Large-Area Nanoimprint Lithography Solution for Microfluidics and Photonics Applications  

EVG_JOANNEUM_Thumbnail ST. FLORIAN / GRAZ, Austria, March 10, 2016 - EV Group (EVG), and JOANNEUM RESEARCH (JR) today announced that they are collaborating on a joint-solution for research and development activities in large-area nanoimprinting leveraging the EVG®770 automated UV-nanoimprint lithography (NIL) step-and-repeat system. Specifically, the two organizations have adapted the EVG770 with new capabilities to accommodate foil substrates that will enable the EVG770 to be used at JR to manufacture flexible master templates applied in roll-to-roll NIL processing for photonics, functional surfaces and microfluidic device production.

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2015 European SEMI Award Honors Paul Lindner  

SEMI_Europe_Award_thumbnailNICE, France - 8 March 2016 - Paul Lindner, executive technology director at EV Group, is the recipient of the 2015 European SEMI Award.  Since 1989, the European SEMI Award has been presented to the person or team that made significant contributions to the European semiconductor and related industries. This award, an industry honor for Lindner, was presented at the SEMI Industry Strategy Symposium Europe 2016 conference held in Nice on 6–8 March.

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EV Group Brings 300-mm Wafer Bonding to MEMS Manufacturing with GEMINI® Automated Wafer Bonder  

EVG_GEMINI300_MEMS_ThumbnailST. FLORIAN, Austria, March 7, 2016 - EV Group (EVG) today announced that its EVG GEMINI® 300-mm automated wafer bonding system is ready for implementation into MEMS high-volume manufacturing (HVM). This marks an important milestone for the MEMS industry, which until now has utilized smaller 200-mm wafer substrates for MEMS HVM.

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WIKA Group Adopts HERCULES® Lithography Track System From EV GROUP for Pressure Sensor Manufacturing  

2016_02_HERCULES 200mm_Teaser

ST. FLORIAN, Austria, February 17, 2016 - EV Group (EVG) today announced that WIKA Group, a global leader in pressure, temperature and level measurement technology, has put an EVG HERCULES® lithography track system into production for manufacturing pressure sensor devices. The HERCULES system has shortly been installed and is in operation at WIKA's fabrication headquarters in Klingenberg, Germany.


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EV Group Joins IRT Nanoelec 3D Integration Program  

2016_02_IRT3D_TeaserST. FLORIAN, Austria, February 5, 2016 -  EV Group (EVG) today announced its participation in the 3D integration consortium of IRT Nanoelec, which is headed by CEA-Leti. EVG joins Leti, STMicroelectronics and Mentor Graphics to develop advanced 3D wafer-to-wafer bonding technologies. SET also joined recently the consortium.

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EV 그룹, 나노종합기술원에 첨단 MEMS 연구 및 파운드리 서비스용 고진공 웨이퍼 본더 공급

Thumbnail_EVG520IS_NNFC 2016 1 27 MEMS , 나노 기술 , 반도체 웨이퍼 본딩 리소그래피 장비 분야의 선도적인 공급 업체인 EV 그룹 ( 이하 EVG) 대전에 위치한 한국나노종합기술원 (NNFC) 고진공 EVG520IS 반자동 웨이퍼 본딩 시스템을 공급했다고 밝혔다 . 한국과학기술원 (KAIST) 계열의 NNFC 이미 EVG520IS 웨이퍼 본더를 보유 중이며 , 첨단 MEMS 연구 파운드리 서비스를 위해 사용하고 있다 . EVG 시스템은 고진공 환경이 요구되는 (5x10 -6 mbar 이상 ) 자이로스코프와 마이크로 - 볼로미터와 같은 MEMS 응용에 매우 이상적이다 .

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