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EV Group Joins IRT Nanoelec 3D Integration Program  

2016_02_IRT3D_TeaserST. FLORIAN, Austria, February 5, 2016 -  EV Group (EVG) today announced its participation in the 3D integration consortium of IRT Nanoelec, which is headed by CEA-Leti. EVG joins Leti, STMicroelectronics and Mentor Graphics to develop advanced 3D wafer-to-wafer bonding technologies. SET also joined recently the consortium.

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EV 그룹, 나노종합기술원에 첨단 MEMS 연구 및 파운드리 서비스용 고진공 웨이퍼 본더 공급

Thumbnail_EVG520IS_NNFC 2016 1 27 MEMS , 나노 기술 , 반도체 웨이퍼 본딩 리소그래피 장비 분야의 선도적인 공급 업체인 EV 그룹 ( 이하 EVG) 대전에 위치한 한국나노종합기술원 (NNFC) 고진공 EVG520IS 반자동 웨이퍼 본딩 시스템을 공급했다고 밝혔다 . 한국과학기술원 (KAIST) 계열의 NNFC 이미 EVG520IS 웨이퍼 본더를 보유 중이며 , 첨단 MEMS 연구 파운드리 서비스를 위해 사용하고 있다 . EVG 시스템은 고진공 환경이 요구되는 (5x10 -6 mbar 이상 ) 자이로스코프와 마이크로 - 볼로미터와 같은 MEMS 응용에 매우 이상적이다 .

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Growth In Engineered Substrate Market For Power Device And Radio Frequency Applications Driving Demand For EV Group Wafer Bonding Solutions

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ST. FLORIAN , Austria, December 16, 2015 —EV Group (EVG) today announced that the company has seen a significant increase in demand for its wafer bonding solutions for engineered substrates over the past year. This rise in demand is driven in part by the rapid growth in the power electronics and radio frequency (RF) device markets - where engineered substrates offer key performance benefits, such as high carrier mobility and reduced power loss/leakage, due to their unique material properties.


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EVG received a Best in MEMS & Sensors Innovation (MEMsies) Award

Thumbnail_MEMS LogoST. FLORIAN, Austria, November 5, 2015 - During this year's MEMS Executive Congress hosted by the MEMS & Sensors Industry Group (MIG) in Napa Valley on November 4-6, EVG received a Best in MEMS & Sensors Innovation (MEMsies) Award for MEMS/Sensors Supplier of the Year.

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