뉴스

EV Group wins Compound Semiconductor Manufacturing Award at the CSindustry awards 2014

CS-Awards-Winnerjpg  FRANKFURT/ ST. FLORIAN, March 19, 2014 - EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, received a prestigious Compound Semiconductor Manufacturing Award at CS International 2014 for the company's EVG®PHABLE™ exposure system.

더보기...
 

EV Group Establishes China Headquarters in Shanghai

201403_EVGChina  SEMICON CHINA, Shanghai, March 18, 2014 - EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced that it has opened a new, wholly owned subsidiary in Shanghai, called EV Group China Ltd., which will serve as regional headquarters for all of EVG's operations in the People's Republic of China.  The new subsidiary, which houses a local service center and spare parts management facility, will further strengthen EVG's presence in the region and support the company's ongoing efforts to improve service and response times to local customers.

더보기...
 

EV Group Boosts 2.5D and 3D-IC/TSV Performance with New NanoSpray™ Application on EVG150XT High-Volume-Manufacturing Photoresist Processing System

EVG2014_03150NXT-Automated-NanoSpray-Coating-System  ST. FLORIAN, Austria, March 12, 2014 - EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced that its patented NanoSpray conformal coating technology is now available on its newly introduced EVG150XT resist coating and developing system for high-volume manufacturing (HVM) semiconductor applications.  NanoSpray provides conformal coating of structures that have vertical sidewall angles-such as through-silicon vias (TSVs), through-glass vias and through-substrate vias used for 2.5D interposers and 3D-ICs-with thick polymer liners and photoresists.  This unique capability, which is already available on previous-generation EVG resist processing platforms, has been used in production to reduce mechanical stress and improve electrical performance of these advanced-packaging interconnect structures.

더보기...
 

EV Group and Brisbane Materials Introduce Novel Anti-Reflective Coating Solution for LED Lighting Applications at Strategies in Light

  201402ARCoatingforLED   STRATEGIES IN LIGHT, Santa Clara, Calif., February 25, 2014 - EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology, solar and semiconductor markets, and Brisbane Materials Technology (BMT), a specialty materials company, today introduced a new anti-reflective (AR) coating solution based on BMT's innovative XeroCoat® materials, which is designed to substantially increase lumen output of light emitting diode (LED) devices.  The jointly developed manufacturing solution, which leverages a combination of AR coating processing equipment and tunable, durable, inorganic coating material, enables lumen output increases of up to eight percent. 

더보기...
 

EV GROUP, 로직 및 메모리 반도체의 고급 패키징 공정에 사용되는 양산 제조용 포토레지스트 공정 시스템 발표

  EVG150XT-HVM-Resist-Processing-System  

2014 2 12 - MEMS , 나노 기술 , 반도체 시장의 웨이퍼 본딩 리소그래피 장비 선도적인 공급 업체인 EV Group ( EVG) 현재 로직 메모리 대량 생산에 필요한 가장 진보된 300mm 포토레지스트 처리 시스템인 EVG150XT(HVM) 개발했다고 발표했다 . EVG XT 프레임 플랫폼을 활용한 장비를 통해 업체들이 선도적이며 다양한 공정에 걸쳐 이용할 있도록 EVG150XT 매우 높은 처리량 생산성 있어서 최적화되어 있다 . 이로써 회사의 리소그래피 전문 공정 지식을 결합하여 양산에 적합한 시스템을 선보이게 됐다 .


더보기...
 

EV Group Ships Temporary Bonding/Debonding System to Fraunhofer ISIT for Developing Advanced Power Devices

  201401EVG-Fraunhofer-ISIT-IGBT-Wafer   ST. FLORIAN, Austria, January 14, 2014 - EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced that the Fraunhofer Institute for Silicon Technology (ISIT) has purchased an EVG®850TB/DB fully automated bonding/debonding equipment solution.  The system has been shipped and installed at Fraunhofer ISIT's facility in Itzehoe, Germany, where it is being used in the development and production of next-generation power devices, including PowerMOS and Insulated Gate Bipolar Transistors (IGBTs).

더보기...