ST. FLORIAN, Austria, August 31, 2015 -
EV Group (EVG)
today announced that the company is experiencing strong demand for its automated 300-mm polymer adhesive wafer bonding systems. Over the past 12 months, the company’s order intake has doubled for these systems, including the EVG
®560, GEMINI® and EVG®850 TB/DB series of wafer bonders. This includes multiple system orders from leading foundries and outsourced semiconductor
assembly and test (OSAT) providers headquartered in Asia. Much of the increase in demand is being fueled by advanced packaging applications, where manufacturers are ramping up production of CMOS image sensors as well as vertically stacked semiconductors incorporating 2.5D and 3D-IC through silicon via (TSV) interconnect technology.