プレスリリース

• EV Group Files Patent Infringement Lawsuit against the 3M Company
• Heptagon Micro-optics Pte Ltd. adopts EV Group's IQ Aligner for Patterning Microlenses for Next-Generation CMOS Image Sensors
• EV Group Supplies 300-mm Equipment to ST Microelectronics for the manufacture of image sensors using TSV technology
• EV Group (EVG) Named among VLSI Research's 10 Best Suppliers for Sixth Consecutive Year
• EV Group to Expand Presence in Korea with opening of Subsidiary to Bolster Growing R&D and High-Volume Manufacturing Efforts
• NanoTecCenter Weiz selects EV Group Mask Aligner for Advanced R&D Facility focused on Organic Electronics
• EV Group Secures Multiple System Order From Colibrys For Production of MEMS-based Motion Sensors
• Indian Institute of Technology, Bombay, selects EV Group Systems for Micro-Fabricated Sensor Research and Development Project
• EV Group wins Multi-Million-Euro order from leading European Electronics Manufacturer for High-Volume Production of Flexible Displays
• EV Group and Brewer Science's New Ultrathin-Wafer Bonding Technology
• EVG achieves record growth in Fiscal 2007 - Posting 30% increase over 2006 in order intake and revenue
• EVG achieves key MEMS Market Milestones, installing 500th Bond Chamber and 100th Automated Wafer Bonder for High-Volume Manufacturing Environments
• EV Group´s new EVG850TB Bonding System selected by Major Austrian Semiconductor Maker for High-Volume, Ultra-Thin Wafer Processing
• Major Austrian semiconductor Manufacturer broadens MEMS and Display device Packaging capacity with installation of fourth IQ Aligner from EV Group.
• UltraThin Wafer Handling solution introduced by Brewer Science and EV Group (EVG)
• EV Group (EVG) signs contract with SemiProbe for worldwide distribution of Wafer Probing Systems
• Customers Rank EV Group (EVG) in 10 BEST for 5 years consecutively in the VLSI Research Wafer Processing Equipment Customer Satisfaction Survey.
• Danchip selects EVG620 Mask Aligner from EV Group (EVG)
• EV Group signs contract with McBain Instruments for worldwide distribution of ZIII-NIR Wafer Inspection System
• EV Group (EVG) and GenISys form ongoing development collaboration on advanced mask aligner lithography simulation for MEMS
• EV Group and Sonix Inc. begin joint cooperation and sign Reseller Distribution Agreement
• EV Group and Datacon extend cooperation on advanced-chip-to-wafer technology (AC2W) and installed EVG540C2W System
• EMC-3D Consortium Created for the Development of Cost-Effective 3D Thru-Silicon-Via Interconnect
• EV Group and Brewer Science cooperate in the development of ultrathin wafer handling solutions for the microelectronics industry
• EV Group offers first online shop provided by a semiconductor process equipment manufacturer at www.EVGTShop.com
• Customers Rank EV Group in Top Half of the VLSI Research 10 BEST
• AMO GmbH has installed the worldwide first step-and-repeat nanoimprint lithography system for industrial fabrication of nanoscale devices from EV Group
• New Nano Spray technology from EVG achieves conformal coating of extreme surface topographies
• おかげさまでEVGは設立25周年を迎え、15年にわたり大量のMEMS製造装置を全世界に提供してまいりました。
  
  
• EV Group to supply NIL Fab, Inc. with High-throughput NanoImprint Lithography System for Prototyping and Low-Volume Production
• EV Group Wins Order from Heptagon for Nanoimprint Lithography Production Equipment for Micro Optic Devices
• IME to develop fully-integrated Lab on Chip with EV Group equipment
• EV Group to support nanofabrication technologies at Stanford with nanoimprint tool
• EV Group、SiTek Electro OpticsにEVG620マスクアライナーを設置
• EV Group announces new Board of Management
• EV Group、業界トップの低温ウェーハ貼り合わせ装置をSilicon Microstructures Inc.に設置
• EV Group、セミコンヨーロッパで業界を先導する新しい次世代ウェーハ貼り合わせ装置を発表
• EV Groupは、DALSAへ量産MEMS製造用にGemini量産用ウェーハ貼り合わせ装置を出荷
• EV Group、オーストリアのInnovation Award 2004を受賞
• EV Group gewinnt den Staatspreis Innovation 2004
• EV Groupの新しい北米本社、拡大している北米の市場と、アリゾナ州立大学と米陸軍との研究開発をサポート
• EV Group collaborates with Jinsan Scientific Co. Ltd. on new cleanroom facility at Korea's Sung Kyun Kwan University
• EV GroupのＩＱアライナー、Promerus LLCでの先端ウェーハレベルパッケージング用材料開発をサポート
• EV Group、ナノスケールデバイスの産業製造用ステップアンドリピートナノインプリントリソグラフィ装置を発表
• EV Group launches global consortium to speed commercialization of nanoimprint lithography
• EV GroupとKomag Inc.、データストレージ仕様で世界初量産ナノインプリントリソグラフィアプリケーション協力
• EV Group gewinnt den Innovationspreis 2004 des Landes Oberösterreich
• EV GroupとDatacon、先端チップツーウェーハ技術(AC2W技術)で協力を表明
• High-tech Kooperation in Österreich: Datacon und EV Group realisieren gemeinsames Forschungsprojekt mit Infineon
• EV Group、アリゾナとニューヨークに研究施設を増設、北アメリカの運営を拡大。
• EV Group expands UV-nanoimprint consortium, sponsors Canadian nanotechnology conference
• EV Group、日本に２番目のカスタマーサポートセンターを開設
• EV Group ships LowTemp production bonder to substrates manufacturer
• EV Group、セミコンウエストでNanoAlign技術と新しいマスクアライナーを初公開
• EV Group Penetrates Microdisplays Market With Sale to MicroEmissive Displays
• EV Group、ナノテクノロジー開発用装置、アジアから受注
• EV Group、日本の大手メーカーより注目すべきLowTempウェーハボンダーを受注
• EV Groupがセミコンチャイナで次世代スプレーコーターと中国語ホームページを公開
• EV Group、北京Tsinghua-Foxconn Nanotechnology Centerの主要サプライヤーに
• EV GroupとAMOGmbHがナノインプリントリソグラフィで協力
• DALSA、MEMSウェーハ貼り合わせおよび厚膜ポリマーリソグラフィ製造装置の戦略的サプライヤーとしてEVGを指名
• McGill University selects EV Group equipment to build nanotools
• EV GroupとSiGenが次世代プラズマ貼り合わせで提携
• EV Group's aligner and bonder enhance biochip research at ASU
• IMEC and EV Group will jointly develop new wafer-level packaging and MEMS wafer bonding techniques
• NRC-IMI selects EV Group to supply a Nanoimprint/Hot embossing system
• EV Group presents new company website www.EVGroup.com
• EV Group sells Production Lithography Package to Silex
• CEA-LETI selects EV Group's hot embossing system to conduct nanotechnology research
• EV Group introduces a new wafer edge inspection system at SEMICON West
• EV Group's temporary bonding and debonding technology enables thinned wafer processing in high volume manufacturing
• EVG、早稲田大学ナノテクノロジーセンターに装置納入
• EV Group Celebrates Opening of New Joint Venture Company in Taiwan
• EVG highlights 300 mm Automated IQ Aligner at SEMICON Europa 2003
• EV Group ships volume MEMS production equipment to Asia Pacific Microsystems Inc.
• EV Group strengthens its activities in the advanced packaging market
• EV Group provides industry first 300 mm volume production wafer bonding system
• Japanese Wafer Manufacturers Produce with SOI Wafer Production Bonding Systems from EVG
• EV Group Announces New EVG40 Series Top-to-Bottom Side Alignment Accuracy Measurement Systems
• EVG highlights Production Resist Processing System for Spin Coating and Developing at SEMICON Japan 2002
• XinTec Inc. Expands Shellcase Chip Scale Packaging Technology with EV Group's Production Mask Aligner and Resist Coater
• EV Group expands its operations into Taiwan
• EV Group's SOI wafer bonding system provides volume, quality and yield enhancements at Analog Devices' SOI wafer production fab
• EV Group appoints new General Manager for EV Group Japan
• HL-Planartechnik社、EVG社HERCULESリソグラフィトラックシステムによるセンサー製造を拡張
• EVG Displays HERCULES Lithography Track System at SEMICON Europa 2002
• EVG社、生産設備および各国人員を増強
• EVG社、300mmSOIウェーハ製造装置を発表 ? セミコンヨーロッパ2002*
• EVG社、全自動300mmSOI製造貼合装置をSOITEC社に出荷
• EV Group Receives SEMI's "Best Paper" Award at SEMICON Taiwan