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ICEPT 2008

July 28 - 31, 2008, Riverfront Business Hotel, Shanghai

Visit our paper presentation: "New Technologies for advanced high density 3D packaging by using TSV process"
Author: Paul Kettner (EV Group)

Micromachine MEMS 2008

July 30 - August 01, 2008, Tokyo, Japan

COMS 2008

August 31 - September 4, 2008, Puerto Vallarta, Mexico

Visit our paper presentation: Nanospray - a new deposition method for isolating layers for 3D TSV applications (Monday C Session)
Speaker: Garrett Oaks (EV Group)

"Initiating a Supplier Alliance for Nanoimprint Lithography (NIL) and Nanoembossing" (Monday B Session)
Speaker: Steven Dwyer (EV Group)

Chairman: Matthias Thorsten (EV Group) Monday C Session, 10AM - 12AM, "Equipment & Process"