Go to the main navigation
Go to content

SOIウェーハ関連マーケット

リソグラフィ

EVG®620 全自動マスクアライナー

マスクアライナーは光学両面リソグラフィ用にデザインされており、R&Dから量産機までお客様のニーズに合わせた製品を取り揃えております。

ボンディング

EVG®20 IR Inspection Station

The EVG20 is designed for qualification of bond quality after pre-bonding.

EVG®301 Semi-automated Single Wafer Cleaner

The EVG300 series single wafer cleaning systems are designed for efficient removal of particles. In semiconductor processing, efficient cleaning and particles removal prior to critical process steps enables maximum yield.

EVG®320 Automated Single Wafer Cleaner

The EVG320 Automated Single Wafer Cleaner is designed for efficient removal of particles prior to critical process steps in semiconductor processing.

EVG®520IS 半自動ウェーハボンダー

The EVG520IS is configurable for all wafer bonding processes such as anodic, thermo compression, fusion bonding, or LowTemp plasma bonding.

EVG®810LT LowTemp® Plasma Activation System

The EVG810LT LowTemp plasma activation system is a single chamber, stand-alone unit for SOI, MEMS, compound semiconductors and advanced substrate bonding.

EVG®850 Automated Production Bonding System for SOI

The EVG850 is designed to fulfill a wide range of fusion wafer bonding applications, with main focus on SOI substrates manufacturing. The EVG850 is the only production bonding system built to operate in high throughput, high-yield environments.

GEMINIFB® Production Fusion Bonding System

EV Group's GEMINIFB provides a fully automated and integrated platform for wafer-to-wafer alignment and wafer bonding.

SmartView® Bond Alignment System for Universal Alignment

The SmartView Aligner offers a proprietary method for micron level face-to-face wafer level alignment.

ソリューション

ニュース/イベント

EV Group Capitalizes on MEMS Market Leadership, Further Diversifies Business

EV Group Introduces Industry's First Fully Automated Wafer Bonding System for HB-LED Manufacturing

その他のニュース ..

NRW - Nano Conference 2010

SEMICON Taiwan 2010

その他のイベント ..

製品カタログ

Solutions for 3D Integration and TSV

EV Group Corporate Brochure

もっと見る

先端パッケージング

化合物半導体/パワーデバイス

ナノテクノロジー

リファレンス

Semiconductor 3-D Equipment and Materials Consortium
EVG is member of the EMC-3D consortium, created for the development of cost-effective 3D TSV (Through-Silicon-Via) interconnect