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SAWデバイス関連マーケット

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EVG®501 Wafer Bonding System

The EVG501 is a highly flexible R&D system that can handle small substrate pieces up to 200 mm wafers.

EVG®510 半自動ウェーハボンダー

The EVG510 is configurable for all wafer bonding processes such as anodic, thermo compression, fusion bonding, or LowTemp plasma bonding.

EVG®520IS 半自動ウェーハボンダー

The EVG520IS is configurable for all wafer bonding processes such as anodic, thermo compression, fusion bonding, or LowTemp plasma bonding.

EVG®540 全自動ウェーハボンダー

The EVG540 is an automated single-chamber production bonder designed for pilot line and manufacturing as well as R&D for high volume manufacturing in Wafer Level Packaging, 3D-Interconnect and MEMS applications.

EVG®560全自動ウェーハボンダー

The EVG560 accepts up to four bond chambers with various bond chamber configuration options for all bonding processes and wafers up to 300 mm.

ソリューション

ニュース/イベント

EV Group Capitalizes on MEMS Market Leadership, Further Diversifies Business

EV Group Introduces Industry's First Fully Automated Wafer Bonding System for HB-LED Manufacturing

その他のニュース ..

NRW - Nano Conference 2010

SEMICON Taiwan 2010

その他のイベント ..

製品カタログ

Solutions for 3D Integration and TSV

EV Group Corporate Brochure

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先端パッケージング

化合物半導体/パワーデバイス

ナノテクノロジー

リファレンス

Semiconductor 3-D Equipment and Materials Consortium
EVG is member of the EMC-3D consortium, created for the development of cost-effective 3D TSV (Through-Silicon-Via) interconnect