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MEMSデバイス関連マーケット

リソグラフィ

EVG® 6200∞　全自動マスクアライナー

Mask aligner designed for optical double-side lithography. Volume production types and manual R&D systems are available.

EVG®101 Large Area Coating System

The EVG101 large area coating system is designed for cost effective coating on large areas.

EVG®101 レジストプロセス措置

The EVG101 series perform R&D type processes on a single chamber design, which is fully compatible with our automated systems.

EVG®105 ベークモジュール

ソフトベーク、露光後ベーク用にデザイン

EVG®120 Automated Resist Processing System

The EVG120 is an economical tool for quality spin coating and develop processes, especially for standard photoresist applications

EVG®150 Automated Resist Processing System

Designed to provide the widest range of process variations, the EVG150 series' modularity accepts spin and spray coating, developing, bake and chill modules to suit your individual production requirements.

EVG®150 NanoSpray Coating System

NanoSpray allows a new bandwidth of applications throughout many technologies in semiconductor processing markets

EVG®510HE - Hot Embossing System

EV Group's EVG510HE is designed for hot embossing applications of polymer substrates and spin-on polymers with excellent pattern fidelity.

EVG®520HE Semi-Automated Hot Embossing System

EV Group's EVG520HE is designed for hot embossing applications of polymer substrates and spin-on polymers with excellent pattern fidelity

EVG®620 全自動マスクアライナー

マスクアライナーは光学両面リソグラフィ用にデザインされており、R&Dから量産機までお客様のニーズに合わせた製品を取り揃えております。

EVG®750 Fully-Automated Hot Embossing System

EV Group's EVG750 is designed for hot embossing applications of polymer substrates and spin-on polymers with excellent pattern fidelity.

Hercules® Lithography Track System up to 300mm

The Hercules is a unique platform with spin coat, bake, chill, align/expose and develop modules, all arranged in one production system.

IQ Aligner® Automated Mask Aligner

The IQ Aligner is based on a field-proven, robust design with up to 300 mm wafer size capability, full-field exposure, single and double-side alignment, large gap and dark field mask alignment.

ボンディング

EVG®510 半自動ウェーハボンダー

The EVG510 is configurable for all wafer bonding processes such as anodic, thermo compression, fusion bonding, or LowTemp plasma bonding.

EVG®520IS 半自動ウェーハボンダー

The EVG520IS is configurable for all wafer bonding processes such as anodic, thermo compression, fusion bonding, or LowTemp plasma bonding.

EVG®540 全自動ウェーハボンダー

The EVG540 is an automated single-chamber production bonder designed for pilot line and manufacturing as well as R&D for high volume manufacturing in Wafer Level Packaging, 3D-Interconnect and MEMS applications.

EVG®540C2W　全自動ウェーハ/チップ・ツー・ウェーハ　ボンダー

The EVG540C2W is designed for permanent bonding on chips to wafer (C2W) on wafer scale.

EVG®560全自動ウェーハボンダー

The EVG560 accepts up to four bond chambers with various bond chamber configuration options for all bonding processes and wafers up to 300 mm.

EVG®6200∞ ボンドアライナー

The EVG6200 bond aligner is designed for wafer-to-wafer alignment for subsequent wafer bonding applications up to 200 mm wafer sizes.

EVG®620ボンドアライナー

Known for its high level of automation and reliability, the EVG620 bond aligner is designed for wafer-to-wafer alignment up to 150 mm wafer sizes.

EVG®805 Semi-automated Debonding System

The EVG805 is a semi-automated system for debonding thin wafers from sapphire, quartz or silicon carriers.

EVG®810LT LowTemp® Plasma Activation System

The EVG810LT LowTemp plasma activation system is a single chamber, stand-alone unit for SOI, MEMS, compound semiconductors and advanced substrate bonding.

EVG®850 Automated Production Bonding System for SOI

The EVG850 is designed to fulfill a wide range of fusion wafer bonding applications, with main focus on SOI substrates manufacturing. The EVG850 is the only production bonding system built to operate in high throughput, high-yield environments.

EVG®850DB Automated Debonder

The EVG850DB Automated Debonder is designed for automated debonding of device wafer from the carrier substrate.

EVG®850TB Automated Temporary Bonder

The EVG850TB bonds compound semiconductor wafers to sapphire, quartz or silicon carriers by use of dry film, spin-on adhesives, or wax.

SmartView®NT Bond Alignment System for Universal Alignment

For wafer-to-wafer alignment via alignment keys in bond interface.

ソリューション

ニュース/イベント

EV Group Capitalizes on MEMS Market Leadership, Further Diversifies Business

EV Group Introduces Industry's First Fully Automated Wafer Bonding System for HB-LED Manufacturing

その他のニュース ..

NRW - Nano Conference 2010

SEMICON Taiwan 2010

その他のイベント ..

製品カタログ

Solutions for 3D Integration and TSV

EV Group Corporate Brochure

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先端パッケージング

化合物半導体/パワーデバイス

ナノテクノロジー

リファレンス

Semiconductor 3-D Equipment and Materials Consortium
EVG is member of the EMC-3D consortium, created for the development of cost-effective 3D TSV (Through-Silicon-Via) interconnect