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CMOSイメージセンサー関連マーケット

リソグラフィ

EVG® 6200∞　全自動マスクアライナー

Mask aligner designed for optical double-side lithography. Volume production types and manual R&D systems are available.

EVG®150 Automated Resist Processing System

Designed to provide the widest range of process variations, the EVG150 series' modularity accepts spin and spray coating, developing, bake and chill modules to suit your individual production requirements.

EVG®150 NanoSpray Coating System

NanoSpray allows a new bandwidth of applications throughout many technologies in semiconductor processing markets

EVG®40NT Measurement System

EV Group offers systems for highly accurate destruction-free alignment accuracy measurements designed for all processes that involve double sided lithography.

EVG®620 Automated UV-NIL, µ-CP System

The EVG620 allows for imprint processes with stamps to substrates ranging from small chip size pieces up to 150 mm in diameter.

EVG®620 全自動マスクアライナー

マスクアライナーは光学両面リソグラフィ用にデザインされており、R&Dから量産機までお客様のニーズに合わせた製品を取り揃えております。

EVG®6200∞ Automated UV-NIL, µ-CP System

The EVG6200 Automated UV-NIL, µ-CP System is designed for For pattern creation in UV-curable materials from a prestructured stamp to a substrate.

EVG®6200NT Automated Mask Aligner

Known for its high level of automation and reliability, the EVG®6200NT bond aligner is designed for wafer-to-wafer alignment up to 200 mm wafer sizes.

EVG®620NT Automated Mask Aligner

Known for its high level of automation and reliability, the EVG®620NT bond aligner is designed for wafer-to-wafer alignment up to 150 mm wafer sizes.

Hercules® Lithography Track System up to 300mm

The Hercules is a unique platform with spin coat, bake, chill, align/expose and develop modules, all arranged in one production system.

IQ Aligner® Automated Mask Aligner

The IQ Aligner is based on a field-proven, robust design with up to 300 mm wafer size capability, full-field exposure, single and double-side alignment, large gap and dark field mask alignment.

IQ Aligner® Automated UV-NIL, µ-CP System

The IQ Aligner automated double-side UV-NIL system allows for micromolding and nanoimprinting processes with stamps and wafers from 150 mm to 300mm diameter.

ボンディング

EVG®510 半自動ウェーハボンダー

The EVG510 is configurable for all wafer bonding processes such as anodic, thermo compression, fusion bonding, or LowTemp plasma bonding.

EVG®520IS 半自動ウェーハボンダー

The EVG520IS is configurable for all wafer bonding processes such as anodic, thermo compression, fusion bonding, or LowTemp plasma bonding.

EVG®540 全自動ウェーハボンダー

The EVG540 is an automated single-chamber production bonder designed for pilot line and manufacturing as well as R&D for high volume manufacturing in Wafer Level Packaging, 3D-Interconnect and MEMS applications.

EVG®560全自動ウェーハボンダー

The EVG560 accepts up to four bond chambers with various bond chamber configuration options for all bonding processes and wafers up to 300 mm.

EVG®850DB Automated Debonder

The EVG850DB Automated Debonder is designed for automated debonding of device wafer from the carrier substrate.

EVG®850TB Automated Temporary Bonder

The EVG850TB bonds compound semiconductor wafers to sapphire, quartz or silicon carriers by use of dry film, spin-on adhesives, or wax.

GEMINI® 全自動量産用ボンダー

EV Group's GEMINI provides a fully automated and integrated platform for wafer-to-wafer alignment and wafer bonding.

GEMINIFB® Production Fusion Bonding System

EV Group's GEMINIFB provides a fully automated and integrated platform for wafer-to-wafer alignment and wafer bonding.

SmartView® Bond Alignment System for Universal Alignment

The SmartView Aligner offers a proprietary method for micron level face-to-face wafer level alignment.

SmartView®NT Bond Alignment System for Universal Alignment

For wafer-to-wafer alignment via alignment keys in bond interface.

ソリューション

ニュース/イベント

EV Group Capitalizes on MEMS Market Leadership, Further Diversifies Business

EV Group Introduces Industry's First Fully Automated Wafer Bonding System for HB-LED Manufacturing

その他のニュース ..

NRW - Nano Conference 2010

SEMICON Taiwan 2010

その他のイベント ..

製品カタログ

Solutions for 3D Integration and TSV

EV Group Corporate Brochure

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先端パッケージング

化合物半導体/パワーデバイス

ナノテクノロジー

リファレンス

Semiconductor 3-D Equipment and Materials Consortium
EVG is member of the EMC-3D consortium, created for the development of cost-effective 3D TSV (Through-Silicon-Via) interconnect