For hot embossing applications of polymer substrates and spin-on polymers
with excellent pattern fidelity.
The EVG520HE semi-automated hot embossing system is designed for embossing
and nanoimprinting applications. This production-proven system from EVG
accepts substrates up to 200 mm and is compatible with standard
semiconductor manufacturing technologies. The hot embossing system is
configured with a universal embossing chamber, high-vacuum and high-contact
force capabilities and manages the whole range of polymers suitable for hot
embossing. Together with high-aspect ratio embossing and multiple
de-embossing options many processes for high quality pattern transfer and
nm resolution are offered.
Features
- For hot embossing and nanoimprinting applications of polymer substrates
and spin-on polymers
- Automated embossing process
- EVG's proprietary separate alignment process for optically aligned
embossing and imprinting
- Pneumatic de-embossing options
- Software controlled process execution
- UV-NIL Option