Mask aligner designed for optical double-side lithography. Volume
production types and manual R&D systems are available.
The EVG6200NT mask aligner-which handles sizes of substrates starting from
3 inches up to 200 mm-offers new state-of-the-art features, including a
granite base, active vibration isolation and linear motors to meet higher
precision and throughput requirements. Built upon EVG's most flexible
and versatile aligner platforms, these new systems enable manufacturers to
easily scale between R&D efforts to volume manufacturing in a simple
one-to-one process transfer from manual mode to full automation. The
ramp-up ease to volume manufacturing coupled with alignment accuracies
improvements-down to 0.1 µm with insitu alignment verification-deliver
significant cost-of-ownership (CoO) benefits.
Features
- High resolution top and bottom side splitfield microscopes
- Handling of multiple wafer sizes with quick change-over time
- High degree of automation (multiple send/receive cassettes)
- Manual substrate loading capability on automated system
- Windows® based
user interface
- Options
- Cassette-to-cassette handling system
- Automatic alignment
- Insitu alignment verification
- Field upgradeable from manual to fully-automated version
-
NanoAlign® package for
enhanced process capabilities
- Thin or warped wafer handling
- Nanoimprint lithography and micro contact printing
- Bond alignment
- Active vibration isolation
- Simulation software for mask aligner lithography process