The EVG40NT measurement system performs highly accurate, non-destructive
top-to-bottom side alignment accuracy measurement on double-sided
structured wafers or bond interfaces as well as CD and Box-in-Box
measurements of single and/or double side structured wafers. The EVG40NT
can accurately measure any type of substrate material up to 300 mm in size.
The measurement system is a highly flexible tool capable of measuring
across the full wafer surface with an unlimited number of measurement
points. With its flexibility it is suitable for different fields of
applications like MEMS, sensors, micro-optics, power devices, compound
semiconductors and silicon-based power devices, hybrid technology,
multi-layers and all technologies that involve double-side lithography
Features
- Highly accurate, destruction-free alignment accuracy measurement of
single- and double-sided structured wafers or bond interfaces
- Repeatable top to bottom side alignment accuracy measurement
- Non-destructive, visible light, self calibrating technology
- PC-based measurement system
- Line Width measurement
- Infrared measurement (Reflective and transmitted)
- Option: Handling system for fully automated high throughput
operation
- Critical Dimension measurement (CD)
- Overlay/ Box-in-Box measurement (BiB)
- Cross hair is centered automatically