The EVG40 measurement system performs precision destruction-free
top-to-bottom side alignment accuracy measurement of double-sided
structured wafers. The EVG40 can accurately measure any type of substrate
material up to 200 mm in size. With its flexibility it is suitable for
different fields of applications like MEMS, sensors, micro-optics, power
devices, compound semiconductors and silicon-based power devices, hybrid
technology, multi-layers and all technologies that involve double-side
lithography
Features
- Highly accurate, destruction-free alignment accuracy measurement
of
double-sided structured wafers
- Repeatable top to bottom side alignment accuracy measurement
- Non-destructive, visible light, self calibrating technology
- PC-based measurement system
- Line Width measurement
- Infrared measurement
- Option: Handling system for fully automated high throughput operation