The EVG501 Wafer Bonding System is a highly flexible R&D system that can handle small substrate pieces up to 200 mm wafers. The new tool supports a variety of bonding
processes, such as anodic, glass frit, eutectic, diffusion, fusion, solder,and adhesive bonds, as well as other thermal processes, including oxide
removal and high temperature bakes under a controlled atmosphere. The system also offers quick re-tooling with a conversion time of less than five
minutes, making it ideal for universities and R&D as well as small-volume production applications.
Features
- Optimum total cost of ownership (TCO) for R&D and pilot line production
- Bonds up to 10 kN force at temperatures up to 450°C
- Real and low-force wafer wedge compensation system for highest yield
- Large process window: temperature uniformity <+/- 1% and pressure uniformity <+/- 5%
- Fully recipe compatible to EVG production bonding systems (EVG520IS, EVG560, GEMINI)
- High-vacuum capable bond chamber (down to 10-5 mbar with turbo molecular pump)
- Open chamber design for fast conversion and maintenance
- Windows based control software and operation interface
- Smallest footprint for a 200 mm bonding system: 0.88 m2