The EVG820 dry film lamination station is used for automated, stress-free
lamination of any kind of dry adhesive film onto the carrier wafer. This
unique lamination technology performs punching of the adhesive tape
supplied on a roll, followed by alignment and lamination. The Material
usually is a double-side adhesive tape, either thermal- or UV- release.
With punching technology size and dimension of tape are freely selectable
and independent from substrate.
Features
- Automated, stress-free and void-free lamination of any kind of dry
adhesive film onto the carrier wafer
- Precision- aligned lamination on carrier wafer
- Protective liner peel-off
- The dry film lamination station can be integrated into a EVG850
temporary bonding system