Designed for efficient removal of particles.
The EVG320 handles wafers and substrates automatically between the process
stations. The robot handling system ensures pre-alignment and loading of
the wafers automatically in a cassette-to-cassette or FOUP-to-FOUP
operation. Besides Di-water rinse, configuration options include megasonic,
brush and diluted chemicals cleaning.
Features
- Up to four cleaning stations
- Fully-automated cassette-to-cassette or FOUP-to-FOUP handling
- Edge handling for double-sided cleaning processes available (option)
- High efficiency cleaning using 1 MHz megasonic nozzles or area
transducers (option)
- Advanced remote diagnostics
- Prevents cross-contamination from back to front side
- Fully software controlled cleaning process