Designed for efficient removal of particles.
The EVG301 employs one cleaning station, which cleans wafers using standard
DI-water rinse as well as megasonic, brush and diluted chemicals as
additional cleaning options. With manual loading and pre-alignment, the
EVG301 is a versatile R&D type system for flexible cleaning procedures
and 300 mm capability. The EVG301 system can be combined with EVG's wafer
alignment and bonding systems to eliminate any particle prior to wafer
bonding. Spinner chucks are available for different wafer and substrate
sizes to allow easy setup for different processes.
Features
- High efficiency cleaning using 1 MHz megasonic nozzles or area
transducers (options)
- Brush scrubbing for single side cleaning (option)
- Diluted chemicals for wafer cleaning
- Prevents cross-contamination from back to frontside
- Fully software controlled cleaning process
- Options
- Pre-bonding station with IR-inspection
- Tooling for non SEMI standard substrates