For wafer-to-wafer alignment via alignment keys in bond interface.
The SmartView®NT Aligner series offers a proprietary method for micron
level face-to-face wafer level alignment. This alignment technique is key
to achieving the required accuracy in multiple wafer stacking for leading
edge technologies. SmartView technology can be combined with the Gemini
wafer bonding systems for subsequent permanent bonding in a fully automated
platform.
Features
- Wafer stacking for 3D interconnect, wafer level packaging and high
volume MEMS devices
- Universal bond aligner (face-to-face-, backside-, infrared- and
transparent alignment)
- No Z-axis motion and no refocusing required
- Windows® based user interface
- Bond pairs are aligned and clamped prior to loading into the bond
chamber
- Manual or fully automated configurations (e.g. integration with Gemini)
- Options
- Can be combined with the EVG500 series wafer bonding systems, EVG300
series cleaning systems and EVG810LT plasma systems for a fully
automated wafer-to-wafer alignment operation with cassette-to-cassette
operation