For wafer-to-wafer alignment via alignment keys in bond interface.
The SmartView Aligner offers a proprietary method for micron level
face-to-face wafer level alignment. This alignment technique is key to
achieving the required accuracy in multiple wafer stacking for leading edge
technologies. SmartView technology can be combined with the Gemini wafer
bonding systems for subsequent permanent bonding in a fully automated
platform.
Features
- Wafer stacking for 3D interconnect, wafer level packaging and high
volume MEMS devices
- Universal bond aligner (face-to-face-, backside-, infrared- and
transparent alignment)
- No Z-axis motion and no refocusing required
- Windows® based
user interface
- Bond pairs are aligned and clamped prior to loading into the bond
chamber
- Manual or fully automated configurations (e.g. integration with Gemini)
- Options
- Integration with wafer pre-treatment (cleaning, activation)
- Can be combined with the EVG500 series wafer bonding systems, EVG300
series cleaning
systems and EVG810LT plasma systems for a fully automated
wafer-to-wafer alignment
operation with cassette-to-cassette operation