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化合物半導体/パワーデバイス関連マーケット

リソグラフィ

EVG® 6200∞　全自動マスクアライナー

Mask aligner designed for optical double-side lithography. Volume production types and manual R&D systems are available.

EVG®101 レジストプロセス措置

The EVG101 series perform R&D type processes on a single chamber design, which is fully compatible with our automated systems.

EVG®120 Automated Resist Processing System

The EVG120 is an economical tool for quality spin coating and develop processes, especially for standard photoresist applications

EVG®150 Automated Resist Processing System

Designed to provide the widest range of process variations, the EVG150 series' modularity accepts spin and spray coating, developing, bake and chill modules to suit your individual production requirements.

EVG®150 NanoSpray Coating System

NanoSpray allows a new bandwidth of applications throughout many technologies in semiconductor processing markets

EVG®40 Top-to-bottom side Measurement System

EV Group offers systems for highly accurate destruction-free alignment accuracy measurements designed for all processes that involve double sided lithography.

EVG®620 全自動マスクアライナー

マスクアライナーは光学両面リソグラフィ用にデザインされており、R&Dから量産機までお客様のニーズに合わせた製品を取り揃えております。

Hercules® Lithography Track System up to 300mm

The Hercules is a unique platform with spin coat, bake, chill, align/expose and develop modules, all arranged in one production system.

IQ Aligner® Automated Mask Aligner

The IQ Aligner is based on a field-proven, robust design with up to 300 mm wafer size capability, full-field exposure, single and double-side alignment, large gap and dark field mask alignment.

ボンディング

EVG®20 IR Inspection Station

The EVG20 is designed for qualification of bond quality after pre-bonding.

EVG®510 半自動ウェーハボンダー

The EVG510 is configurable for all wafer bonding processes such as anodic, thermo compression, fusion bonding, or LowTemp plasma bonding.

EVG®520IS 半自動ウェーハボンダー

The EVG520IS is configurable for all wafer bonding processes such as anodic, thermo compression, fusion bonding, or LowTemp plasma bonding.

EVG®540 全自動ウェーハボンダー

The EVG540 is an automated single-chamber production bonder designed for pilot line and manufacturing as well as R&D for high volume manufacturing in Wafer Level Packaging, 3D-Interconnect and MEMS applications.

EVG®540C2W　全自動ウェーハ/チップ・ツー・ウェーハ　ボンダー

The EVG540C2W is designed for permanent bonding on chips to wafer (C2W) on wafer scale.

EVG®560全自動ウェーハボンダー

The EVG560 accepts up to four bond chambers with various bond chamber configuration options for all bonding processes and wafers up to 300 mm.

EVG®6200∞ ボンドアライナー

The EVG6200 bond aligner is designed for wafer-to-wafer alignment for subsequent wafer bonding applications up to 200 mm wafer sizes.

EVG®620ボンドアライナー

Known for its high level of automation and reliability, the EVG620 bond aligner is designed for wafer-to-wafer alignment up to 150 mm wafer sizes.

EVG®805 Semi-automated Debonding System

The EVG805 is a semi-automated system for debonding thin wafers from sapphire, quartz or silicon carriers.

EVG®810LT LowTemp® Plasma Activation System

The EVG810LT LowTemp plasma activation system is a single chamber, stand-alone unit for SOI, MEMS, compound semiconductors and advanced substrate bonding.

EVG®820 Dry Film Lamination System

The EVG820 dry film lamination station is used for automated, stress-free lamination of any kind of dry adhesive film onto the carrier wafer.

EVG®850DB Automated Debonder

The EVG850DB Automated Debonder is designed for automated debonding of device wafer from the carrier substrate.

EVG®850TB Automated Temporary Bonder

The EVG850TB bonds compound semiconductor wafers to sapphire, quartz or silicon carriers by use of dry film, spin-on adhesives, or wax.

GEMINI® 全自動量産用ボンダー

EV Group's GEMINI provides a fully automated and integrated platform for wafer-to-wafer alignment and wafer bonding.

SmartView® Bond Alignment System for Universal Alignment

The SmartView Aligner offers a proprietary method for micron level face-to-face wafer level alignment.

アプリケーション

更に詳しく製品を調べる

ニュース/イベント

EV Group Capitalizes on MEMS Market Leadership, Further Diversifies Business

EV Group Introduces Industry's First Fully Automated Wafer Bonding System for HB-LED Manufacturing

その他のニュース ..

NRW - Nano Conference 2010

SEMICON Taiwan 2010

その他のイベント ..

製品カタログ

Solutions for 3D Integration and TSV

EV Group Corporate Brochure

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リファレンス

Brewer Science's high performance WaferBOND™ HT materials for temporary bonding and debonding