化合物半導体とパワーデバイス
Microelectronic applications fabricated out of compound semiconductors as
well as silicon-based power devices basically require dedicated
manufacturing technologies offered by EVG.
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High-power LEDs redesigned to replace fluorescent and neon
light sources and are used in surgical, traffic and
automotive applications. Courtesy of LumiLeds
Lighting.
Sub-µm high-aspect ratio structures
created with DUV-Lithography.
Courtesy of CEETAM.
Cross-section SEM image of an InP/GaAs wafer pair bonded
using a Au:Sn eutectic wafer bonding process. Source: EVG.
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SEM Image showing an array of micromirrors. Micromirrors
are combinations of microelectronic and optical components.
Courtesy of Seoul National University.
Cross-section of temporary bond utilizing Brewer Science's
HT series
adhesive. Source: EVG.
Scanning Acoustic Microscope (SAM) image of an InP/GaAs
wafer pair bonded using a Au:Sn eutectic wafer bonding
process. Source: EVG.
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