過去のニュース 2011
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先端パッケージング、半導体、
MEMS
、
SOI
やナノテクノロジー分野で用いられるウェーハ接合装置やリソグラフィ装置のリーディングサプライヤーである
EV Group
（
本社：オーストリア サンクト・フローリアン、
EVG
）は、高解像度ウェーハレベルオプティクス材料の共同開発を目的として、旭化成イーマテリアルズ株式会社より
UV
ナノインプリントリソグラフィ装置（
IQ
アライナー）を受注したことを発表しました。
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先端パッケージング、半導体、
MEMS
、
SOI
やナノテクノロジー分野で用いられるウェーハ接合装置やリソグラフィ装置のリーディングサプライヤーである
EV Group
（
本社：オーストリア サンクト・フローリアン、以下
EVG
）は
、
新たな装置プラットフォーム「
XT Frame
」を発表しました。
XT Frame
はあらゆる量産用製造装置において処理能力と機能性の向上を実現します。特に量産（
HVM
）装置メーカーからの新たな要望に応えるため設計された
XT Frame
は、最大
9
つのプロセスモジュールが搭載でき、当社従来品の最大
2
倍の処理能力を有しています。さらに、ユーザーは単一の装置プラットフォーム上で様々なプロセスモジュールを柔軟に組み合わせることができます。
XT Frame
プラットフォームで構築された製品は即時受注可能です。
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 | | ST. FLORIAN, Austria, November 8, 2011 - EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced that Shanghai Simgui Technology Co., Ltd. (Simgui), a leading Chinese wafer manufacturer, has placed a follow-on order for an EVG850 automated production bonding system for silicon-on-insulator (SOI) and direct wafer bonding. |
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 | | ST. FLORIAN, Austria, October 26, 2011- EV Group (EVG) today announced that it has launched a suite of groundbreaking temporary bonding and debonding (TB/DB) equipment modules that support ZoneBOND™ technology. In parallel, EVG has opened its TB/DB equipment platform to enable the use of a wide range of adhesives from various suppliers to give customers the most flexible choice of bonding materials. |
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 | | ROLLA, MO, USA and ST. FLORIAN, AUSTRIA, October 20, 2011 - Brewer Science, Inc., a global leading innovator and manufacturer of specialty materials, process solutions, and equipment for the microelectronics industry, and EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology, and semiconductor markets, today announced an agreement on ZoneBOND™ technology. |
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 | | SEMICON EUROPA, Dresden, Germany, October 11, 2011-EV Group (EVG) today announced that it has established an agreement with world-renowned research institute Fraunhofer IZM-ASSID to jointly develop high-volume manufacturing processes for 3D IC integration applications. |
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 | | ST. FLORIAN, Austria, Sept. 7, 2011 - EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced that it is launching a new flagship model in its field-proven GEMINI FB fusion wafer bonding family that increases system throughput to up to 20 wafers per hour. |
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 | | ST. FLORIAN AM INN, July 27, 2011-EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced it broke ground on expanding the company's manufacturing capacity at its headquarters in Austria earlier this month. This expansion is the latest example of the company's continued steady growth since its foundation more than 30 years ago. |
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 | | Singapore, 27 July 2011 - The Industrial Consortium On Nanoimprint (ICON), which is helmed by the Institute of Materials Research and Engineering (IMRE), a research institute of Singapore’s Agency for Science, Technology and Research (A*STAR), is ready to put roll-to-roll nanoimprint manufacturing to the test. |
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ALBANY, N.Y. / ST. FLORIAN, Austria, July 18, 2011 - SEMATECH, the global consortium of chipmakers and catalyst for accelerating the commercialization of technology innovations into manufacturing solutions, presented the consortium’s patterning strategy at the ISMI (International SEMATECH Manufacturing Initiative) 450 mm Industry Briefing during SEMICON West 2011.
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 | | SEMICON WEST, San Francisco, July 12, 2011 - EV Group (EVG) today announced it will showcase a number of recent corporate and technology developments at SEMICON West 2011. The company has seen an increase in order intake in fiscal 2011 of approximately 40 percent compared with fiscal 2010, and will break ground this month on an expansion that will more than double its manufacturing floor space. |
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 | | SEMICON WEST, SAN FRANCISCO, Calif., July 11, 2011 - EV Group (EVG) today unveiled the semiconductor industry's first bonding system for 450-mm-diameter wafers manufactured from silicon-on-insulator (SOI) substrates. Building on EVG's leadership in SOI wafer bonding, the new system - dubbed the EVG850SOI/450mm - was created to support and facilitate the industry transition to 450mm wafers from the current 300mm standard. |
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 | | ST. FLORIAN, Austria, July 6, 2011 - EV Group (EVG) today announced its engagement with the Georgia Institute of Technology 3D Systems Packaging Research Center (GT PRC) as a Manufacturing Infrastructure Member. Through the consortia membership, EVG's state-of-the-art temporary bonding and debonding, chip-to-wafer bonding and lithography technology and associated product and process know-how will be included in the PRC's Silicon and Glass Interposer Industry (SiGI) Consortium research program. |
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 | | ST. FLORIAN, Austria, June 28, 2011 - EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced it has received an order for its Gemini fully automated wafer-bonding system. The Gemini system will be installed at the MiQro Innovation Collaborative Centre (C2MI), which is currently under construction in Technoparc Bromont (Quebec, Canada). |
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 | | ST. FLORIAN, Austria, June 21, 2011 - EV Group (EVG) today announced it has introduced a new in-line metrology module for its EVG850TB automated temporary bonding and debonding systems. This new metrology capability, which is now available as an option on the EVG850TB and EVG850DB platforms, allows customers to implement in-line process control for thin-wafer processing. |
もっとみる... Singapore, 15 June 2011 - The Institute of Microelectronics (IME), a research institute of the Agency for Science, Technology and Research (A*STAR) has launched its 11th Electronic Packaging Research Consortium (EPRC11) to address various technology challenges in advanced packaging technology in semiconductor in enabling smaller and smarter devices.
もっとみる... PHOENIX, Ariz., June 1, 2011 -The SEMI Foundation presents the 119th High Tech U program in Phoenix, June 7-9, 2011 to support education and career awareness in the fields of high technology. During the three-day program, 36 students from Greater Phoenix area high schools will attend classes taught by volunteer industry professionals at the campuses of the EVG Group and ON Semiconductor.
もっとみる... ST. FLORIAN, Austria, June 1, 2011 -EV Group (EVG) today announced that it is collaborating with the Industrial Technology Research Institute (ITRI)-Taiwan's largest and one of the world's leading high-tech R&D institutions-in the development of advanced manufacturing processes for next-generation MEMS devices. As part of the collaboration, ITRI has purchased an EVG510 semi-automated wafer bonding system and an EVG6200 automated mask alignment system with top-bottom alignment and bond alignment options.
もっとみる... ST. FLORIAN, Austria, May 17, 2011 - EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, is pleased to announce that the company has, for the ninth consecutive year, received the distinction of being named one of the world’s top 10 small equipment providers in a well respected industry customer satisfaction survey.
もっとみる... ST. FLORIAN, Austria, April 19, 2011 - EV Group (EVG) today announced that its longtime customer and partner, industry-leading research center CEA-Leti (Grenoble, France), has installed multiple EVG tools in its industry-first 300-mm cleanroom dedicated to R&D and prototyping for 3D-integration applications. While Leti's new state-of-the-art facility is focused on R&D and prototyping, EVG's equipment will be leveraged with an eye toward widespread adoption of 3D technology for high-volume applications
もっとみる... ST. FLORIAN, Austria, April 11, 2011 - EV Group (EVG) today announced that it has received the 2010 European Nanoimprint Technology Product Innovation Award from independent market research firm, Frost & Sullivan. The prestigious award recognizes EVG's accomplishments in addressing industrial needs with nanoimprinting solutions.
もっとみる... CS EUROPE, Frankfurt, Germany, March 29, 2011 – EV Group (EVG) today received the CS Industry Award for “EPIWAFER PROCESSING” for its EVG®850TB/DB Temporary Bonding/Debonding Systems. The inaugural Compound Semiconductor Industry Awards were presented at the CS Europe Conference in Frankfurt, Germany, which was attended by 150 industry professionals. The awards were established to recognise success and development along the entire value chain of the compound semiconductor industry from research to completed device, focusing on the people, processes and products that drive the industry forward.
もっとみる... SEMICON CHINA 2011, Shanghai, March 15, 2011 - EV Group (EVG) today announced that new customer Shenyang Silicon Technology Co., Ltd. (SST) has placed an order for an EVG850LT automated production bonding system for silicon-on-insulator (SOI) wafers. The China-U.S. joint venture firm will utilize the EVG850LT, which was shipped in September 2010, in its state-of-the-art SOI production facility to expedite its efforts to ramp up high-volume manufacture of SOI wafers.
もっとみる... この度東日本大震災により被災された皆様に心からお見舞い申し上げます
。
皆様の安全と被災地の一日も早い復旧をお祈り申し上げます。イーヴィグループ一同は復旧に向けて全力で支援してまいります。もっとみる... STRATEGIES IN LIGHT, Santa Clara, Calif., February 22, 2011 - EV Group (EVG) today announced the latest addition to its portfolio of products created to optimize the manufacture of high-brightness light-emitting diodes (HB-LEDs), compound semiconductors and power electronics. The new EVG620HBL fully automated mask alignment system builds on EVG's field-proven mask aligner platform, adding a high-intensity ultraviolet (UV) light source and five cassette stations - significantly more than competitive offerings - to enable continuous fabrication of devices.
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