過去のニュース 2010
CARLSBAD, Calif., Dec. 8, 2010 - Shrink Nanotechnology announced today that it has entered into a multi-year development and manufacturing agreement with EV Group, a leader in the nano-imprint lithography process development and equipment manufacturing. The mutually exclusive, two year agreement calls for EV Group and Shrink to develop and manufacture Shrink’s structured substrates for its StemDisc stem cell and cell culturing platform.
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セミコンジャパン、日本
2010
年 12
月 1
日－先端パッケージング、半導体、 MEMS
、 SOI
やナノテクノロジー分野で用いられるウェーハ接合装置やリソグラフィ装置のリーディングサプライヤーである EV Group
（ EVG
）は、スマートフォンや Pico Projector
、その他様々なアプリケーションに対応する高解像度ウェーハレベルオプティクス（最大 8
メガピクセル）の量産を可能にする新しいマイクロレンズモールディング技術を開発しました。
もっとみる... ST. FLORIAN, Austria, November 2, 2010 - EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced that the company witnessed a more than 20-percent increase in overall revenue during fiscal 2010, ended September 30.
もっとみる... SEMICON EUROPA, Dresden, Germany, October 19, 2010 - EV Group (EVG) today announced the latest addition to its industry-leading EVG500 Series of permanent wafer bonding systems. The new three-chamber EVG520L3 wafer bonding system builds on the series' proven strengths in temperature control, piston force uniformity and modularity, with the next major implementation of the bond chamber concept-addressing the need for high-vacuum, CMOS-compatible bonding processes while delivering significantly higher throughput, cost of ownership (CoO) and yields.
もっとみる... SEMICON EUROPA, Dresden, Germany, October 19, 2010 - EV Group (EVG) today announced receipt of its first order from the Fraunhofer Research Institution for Electronic Nano Systems ENAS (Chemnitz, Germany). Fraunhofer ENAS purchased an EVG6200NT automated mask aligner and an EVG540 automated wafer bonder, and will employ the flexible, multi-process EVG systems for mask lithography, ultraviolet nanoimprint lithography (UV-NIL), bond alignment, bonding and hot embossing (HE).
もっとみる... SEMICON EUROPA, Dresden, Germany, October 18, 2010 - EV Group (EVG) today announced it has received an order for its GEMINI® fully automated wafer bonding system from Sensonor Technologies AS-a pioneer in the manufacture of MEMS sensors.
もっとみる... NNT CONFERENCE, Copenhagen, Denmark, October 13, 2010 - EV Group (EVG) today unveiled a new technology capability that enables ultra-high resolution patterning of features down to 12.5 nm: Soft Molecular Scale Nanoimprint Lithography (SMS-NIL). Based on EVG's proven UV-NIL systems, SMS-NIL provides customers with a repeatable, cost-effective process for producing ultra-high-resolution patterning on large-area surfaces.
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MEMS、ナノテクノロジー、半導体分野において、ウェーハ貼り合わせ装置およびリソグラフィ装置のリーディングサプライヤーであるEV Group（本社：オーストリア サンクト・フローリアン、EVG）は、イーヴィグループジャパン株式会社（本社：神奈川県横浜市、以下イーヴィグループジャパン）が、国立大学法人東京大学（所在地：東京都文京区、以下東京大学）に化合物半導体研究用途としてメガソニックウェーハ洗浄装置EVG301を納入したことを発表しました。もっとみる... ST. FLORIAN, Austria, September 23, 2010 – EV Group (EVG) today announced it has shipped an EVG520IS semi-automated wafer bonding system and two EVG6200 automated alignment systems to King Abdullah University of Science and Technology (KAUST) in Saudi Arabia. Students at the graduate-level institution will use the EVG equipment for advanced technology research and development, including projects outsourced to KAUST from technology firms in the region.
もっとみる... ST.FLORIAN, 14 September 2010 – EV Group (EVG), a technology and market leader for wafer processing equipment, was recently awarded ISO 14001 certification. This award certifies that the Austria-based company exhibits an effective environmental management system and is committed to pursuing further environmental activities.
もっとみる... SEMICON WEST, San Francisco, July 13, 2010 – EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced it has received an order for its EVG520IS semi-automated wafer bonding system and EVG620TB mask and bond aligner from the University of Texas at Arlington (UTA).
もっとみる... ST. FLORIAN, Austria, July 12, 2010 - EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced that it has introduced the EVG560HBL wafer bonder-the industry's first fully automated wafer bonding system for high-brightness light emitting diode (HB-LED) manufacturing.
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St. Florian, AUSTRIA and SINGAPORE, July 8, 2010–
EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, and the Institute of Microelectronics (IME), a research institute of the Agency for Science, Technology and Research (A*STAR), today announced that they have entered into a two-year cooperation agreement to advance 3D IC integration technologies.もっとみる... ST. FLORIAN, AUSTRIA, July 6, 2010 - EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced that it has introduced the EVG610 mask and bond aligner, specifically to address its university and research customers' demands for a lower costing system with greater process versatility.
もっとみる... ST. FLORIAN, Austria, May 31, 2010 - EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced that world-renowned research institute, Fraunhofer IZM-ASSID, has placed an order for two EVG temporary bonding and debonding (TB/DB) systems for thin-wafer handling and processing for 3D ICs.
もっとみる... ST. FLORIAN, AUSTRIA, March 30, 2010 - EV Group (EVG) today announced that Morocco-based wafer-level camera manufacturer Nemotek Technologie has placed a repeat order for EVG’s bonding and UV nanoimprint lithography (UV-NIL) systems – the EVG520IS and IQ Aligner.
もっとみる... ST. FLORIAN, AUSTRIA, March 2, 2010 - EV Group (EVG) today announced that it has shipped two wafer bonding systems to the University of Michigan's Lurie Nanofabrication Facility (LNF) - a leading center for MEMS and microsystems research and an integral member of the National Nanotechnology Infrastructure Network (NNIN), which is supported by the National Science Foundation.
もっとみる... NANO TECH 2010-TOKYO, JAPAN, February 9, 2010 - NILCom, a nanoimprint lithography consortium comprising companies and research organizations throughout the imprint lithography supply chain, will be exhibiting at nano tech 2010 held February 17-19 in Tokyo, Japan.
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