ニュース
University of Michigan's Lurie Nanofabrication Facility selects EV Group Wafer Bonding Systems for advanced MEMS research
ST. FLORIAN, AUSTRIA, March 2, 2010 - EV Group (EVG) today announced that it has shipped two wafer bonding systems to the University of Michigan's Lurie Nanofabrication Facility (LNF) - a leading center for MEMS and microsystems research and an integral member of the National Nanotechnology Infrastructure Network (NNIN), which is supported by the National Science Foundation.
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NILCOM consortium to highlight latest developments at nano tech 2010
NANO TECH 2010-TOKYO, JAPAN, February 9, 2010 - NILCom, a nanoimprint lithography consortium comprising companies and research organizations throughout the imprint lithography supply chain, will be exhibiting at nano tech 2010 held February 17-19 in Tokyo, Japan.
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SEMEFAB broadens diverse process portfolio with the installation of an EVG520IS Wafer Bonding System
GLENROTHES, SCOTLAND, UK, November 5, 2009 - Semefab (Scotland) Ltd, a leading, independent wafer fab foundry, today announced that it will further broaden its diverse process portfolio with the installation of a wafer bonding system from EV Group.
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EV Group installs fusion Wafer Bonding Systems at two leading CMOS image sensor manufacturing facilities in Asia
SEMICON Europa 2009, October 6, 2009 – EV Group (EVG) today announced that it has completed the installation of two automated fusion bonding systems for 300-mm wafers at a leading semiconductor foundry and at a major consumer electronics manufacturer.
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EV Group´s GEMINI® Wafer Bonder selected by leading Korean Research Center and foundry service provider RFID/USN for 3D MEMS Manufacturing
September 29, 2009 - EV Group (EVG) today announced that the RFID/USN Center (Incheon, Korea) has selected EVG's fully automated GEMINI® wafer bonding system for stacked 3D MEMS device development
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EV Group hosts its first EVG Technology Day in Turkey to support the region's growing R&D efforts in Advanced MEMS, NEMS and Semiconductors
September 17, 2009 - EV Group (EVG) today announced that it will host an EVG Technology Day on October 2, 2009 at the Bilkent Hotel in Ankara, Turkey.
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EV Group to collaborate with Applied Materials on thin wafer bonding technology for 3D IC development
ST. FLORIAN, AUSTRIA, July 16, 2009 - EV Group (EVG) today announced a joint effort with Applied Materials, Inc. to develop wafer bonding processes for the manufacture of through-silicon vias (TSVs)
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EV Group witnesses rise in order intake and increase in demand for services
SEMICON WEST, San Francisco, Calif. July 14, 2009 - EV Group (EVG), today announced it is witnessing continued momentum during its fiscal year 2009 as the company moves through its third quarter, ending June 30.
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EV Group unveils next-generation UV-nanoimprint lithography (UV-NIL) step and repeat system - the EVG770 Gen II NILStepper
ST. FLORIAN, AUSTRIA, July 13, 2009 - EV Group (EVG), today unveiled its next-generation UV-nanoimprint lithography (UV-NIL) step and repeat system-the EVG770 Gen II NIL Stepper.
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EV Group secures order for 300 mm wafer bonder from Sematech's 3D interconnect program at Ualbany Nanocollege
ALBANY, NEW YORK and ST. FLORIAN, AUSTRIA, July 9, 2009 - EV Group (EVG), today announced that SEMATECH, the global consortium of chipmakers, has selected EVG's fully automated 300-mm GEMINI® wafer bonder for enabling next-generation TSV and 3D interconnects.
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IME launches 10th Electronic Packaging Research Consortium to address 3-dimensional integrated circuits
Singapore, 30 June 2009 - The Institute of Microelectronics (IME), a research institute of the Agency for Science, Technology and Research (A*STAR), today announced the launch of the 10th Electronic Packaging Research Consortium (EPRC-10) to address key integration challenges of 3-dimensional (3-D) Packaging and Embedded Module technologies during a signing ceremony.
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EV Group completes wafer bonding portfolio with the launch of its new generation EVG501 R&D system
June 9, 2009 - EV Group (EVG) today announced that it has launched an all-new EVG501 wafer bonder system to address rising cost burdens for its university and R&D customers.
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MCA Public Relations to host BrightspotsForum on 3D IC Technology
MOUNTAIN VIEW, Calif., June 8, 2009—MCA, a global, high-tech public relations agency, today announced it will be hosting an online panel discussion in cooperation with SemiNeedle, dubbed the BrightSpots 3D IC Forum, which will enable industry professionals to partake in an active discussion exploring the key issues surrounding 3D ICs from design to manufacture.
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EV Group secures order win from leading RF components manufacturer EPCOS
June 4, 2009 - EV Group (EVG) today announced that EPCOS – a leading electronic components, modules and systems manufacturer – selected EVG’s fully automated GEMINI wafer bonder for high-volume RF components production at EPCOS’s production facility based in Munich, Germany.
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EVG named among Top 5 in VLSI Research's The Best Chip Making Equipment Suppliers by Segment
May 20, 2009 – EV Group (EVG), is pleased to announce that the company has received the distinction of being named one of the world’s top 10 small suppliers of wafer processing equipment for the seventh consecutive year by VLSI Research, Inc.
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Fraunhofer IOF selects EV Group UV-Nanoimprint Lithography (UV-NIL) System for Leading-Edge applied Optoelectronics R&D
May 12, 2009 - EV Group (EVG) today announced that Fraunhofer Institute for Applied Optics and Precision Engineering IOF oriented research-selected EVG's UV-based nanoimprint lithography (UV-NIL) step and repeat system for its leading-edge optoelectronic research efforts.
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EV Group gains Amberwave Systems as a new customer for bonding and plasma activation solutions
April 29, 2009 - EV Group (EVG) today announced it has received an order from
AmberWave Systems for its EVG520IS wafer bonding system and its EVG810LT
low-temperature plasma activation system.
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EV Group realizes strong first half year in fiscal 2009
April 22, 2009 - EV Group (EVG) today announced that the company will increase
its production capacity in light of strong order intake in its first half year
of fiscal 2009.
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EV Group and CEA/Leti Partner to accelerate adoption of TSV and 3D Integration Technology
April 1, 2009 - EV Group (EVG) today announced it has entered a joint
development program (JDP) with CEA/Leti-one of Europe's renowned research labs
focusing on microelectronics and nanotechnology.
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EV Group receives order for photoresist developer from the University of Tokyo
March 17, 2009 - EV Group (EVG) today announced that they have received an
order for its EVG101D, a photoresist developer, from the University of Tokyo.
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Applied Materials joins EMC-3D equipment and materials consortium
February 24, 2009 - The international EMC-3D semiconductor equipment and
materials consortium today announced that Applied Materials, Inc. (Nasdaq:
AMAT) has joined the organization.
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EV Group receives significant follow-on order from leading pure-play MEMS foundry Silex Microsystems
February 3, 2009 - EV Group (EVG) today announced that Sweden-based Silex
Microsystems, the world's largest independent MEMS foundry, has placed a major
follow-on order for its GEMINI automated bond cluster, EVG 6200NT mask and bond
aligner and EVG301 mask cleaner.
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EV Group demonstrates continued MEMS leadership around the globe with order win from Samsung Electro-Mechanics
January 20, 2009 - EV Group (EVG) today announced that leading Korean
components manufacturer, Samsung Electro-Mechanics Co., LTD. (SEMCO), selected
the company’s EVG810LT, a LowTemp® plasma activation system, for its R&D
work involving stacked and 3D MEMS devices.
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EV Group and Brewer Science establish Ultra-Thin Wafer Bonding Lab in Taiwan
January 7, 2009 - EV Group (EVG) and Brewer Science, Inc., today announced the
installation of an EVG 500 series wafer-bonding system at Brewer Science's
Taiwan applications lab.
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3M and EV Group settle patent infringement suit
December 22, 2008 - ST. PAUL, Minn. / ST. FLORIAN, today have agreed to settle
the patent infringement litigation brought by EVG against 3M in the U.S.
District Court for the Southern District of New York relating to systems for
temporary wafer bonding.
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EV Group introduces new suite of aligners and measurement systems for 3D IC and other advanced semiconductor, MEMS and Nanotechnology device manufacturing
December 1, 2008 - EV Group (EVG), today introduced the NT series-a new, yet
already field-proven suite of mask aligners, wafer-to-wafer (W2W) bond aligners
and measurement systems-to address increased demand for higher precision
alignment accuracy.
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EV Group realizes continued Growth for Fiscal 2008
November 19, 2008 - EV Group (EVG) , today announced that the company witnessed
a more than 15-percent increase in overall revenue during fiscal 2008, ended
September 30.
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EV Group appoints Industry Veteran Dr. Weonsik Yang as General Manager of Korean Subsidiary
November 12, 2008 - EV Group (EVG) , today announced it has appointed Dr.
Weonsik Yang as the new general manager of EV Group Korea Ltd.
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EV Group ships 100th Nanoimprint Lithography System, reinforcing Company's Leadership in NIL Market
October 13, 2008 - EV Group (EVG) today announced it has shipped its 100th
nanoimprint lithography (NIL) system.
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EV Group receives Multiple-system Orders from Leading European Universities for Innovative MEMS Research & Development
October 06, 2008 - EV Group (EVG) today announced that three European
universities-Southampton University, University of Ulster and Technische
Universitat Braunschweig-have placed orders for multiple EVG systems.
These follow-on order wins for leading-edge MEMS research are for
next-generation EVG systems, totaling in excess of US$2.9 million.
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EV Group Files Patent Infringement Lawsuit Against the 3M Company
July 14, 2008 - EV Group today announced that it has filed a
patent infringement lawsuit in federal court of New York against the 3M
Company.
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Heptagon Micro-optics Pte Ltd. Adopts EV Group’s IQ Aligner for Patterning Microlenses for Next-Generation CMOS Image Sensors
July 14, 2008 - EV Group today announced that Heptagon Micro-Optics Pte Ltd. in
Singapore - a wholly-owned subsidiary of Finnish-Swiss wafer-scale micro-optics
manufacturer, Heptagon - has purchased an advanced IQ Aligner for UV-based
nanoimprint lithography (UV-NIL).
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EV Group Supplies 300-mm Equipment to STMicroelectronics for the Manufacture of Image Sensors Using TSV Technology
July 8, 2008 - Significant Multi-Million-Euro Order Win
Furthers EVG’s Reach in the 3D Interconnect Space
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EV Group Named among VLSI Research’s 10 Best Suppliers for Sixth Consecutive Year
July 1, 2008 – EV Group is pleased to announce that the
company has received the distinction of being ranked as one of the world’s 10
BEST small suppliers of wafer processing equipment by VLSI Research,
Inc.
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EV Group to Expand Presence in Korea with Opening of Subsidiary to Bolster Growing R&D and High-Volume Manufacturing Efforts
May 14, 2008 - EV Group today announced that it will open a
new subsidiary in Seoul, Korea.
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NanoTecCenter Weiz Selects EV Group Mask Aligner for Advanced R&D Facility Focused on Organic Electronics
March 11, 2008 - EV Group today announced that Austrian
technology-research company NTC Weiz has purchased an EVG620 precision
alignment system for installation in its new R&D facility focused on
organic/plastic electronics.
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Indian Institute of Technology, Bombay, Selects EVG Systems for Micro-Fabricated Sensor Research and Development Project
February 5, 2008 - EV Group today announced it has received
an order from the Indian Institute of Technology (IIT), Bombay, for two of EVG´
s MEMS-focused systems.
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EV Group Secures Multiple System Order from Colibrys for Production of MEMS-based Motion Sensors
February 21, 2008 - EV Group today announced that it has
received a multiple system order from Colibrys, a world-leading supplier of
standard and custom MEMS-based motion sensors for harsh-environment and safety
critical applications.
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EV Group Wins Multi-Million-Euro Order from Leading European Electronics Manufacturer for High-Volume Production of Flexible Displays
January 16, 2008 - EV Group today announced that it has
received a multi-million-Euro order from a leading European plastic electronics
manufacturer for the high-volume production of flexible displays.
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EV Group and Brewer Science's New Ultra-thin-Wafer Bonding Technology
December 4, 2007 - A key industry milestone has been reached
today surrounding the handling and processing of ultrathin wafers. In their
ongoing joint development work, EV Group and Brewer Science,
Inc., unveiled they have demonstrated temporary wafer bonding capabilities
for a wide range of backside processes, including through-silicon vias (TSVs)
and backside metallization.
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EV Group Achieves Record Growth in Fiscal 2007 - Posting 30% Increase over 2006 in Order Intake and Revenue
November 6, 2007 - Record Growth in Fiscal 2007 - Posting 30% Increase over
2006 in Order Intake and Revenue
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EV Group Achieves Key MEMS Market Milestones, Installing 500th Bond Chamber and 100th Automated Wafer Bonder for High-Volume Manufacturing Environments
November 1, 2007 – EV Group today announced it has
successfully installed its 500th bond chamber and 100th automated production
wafer bonder for high-volume manufacturing.
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EV Group´s new EVG850TB Bonding System Selected by Major Austrian Semiconductor Maker for High-Volume, Ultra-thin Wafer Processing
October 9, 2007 - EV Group today announced that a major
Austrian semiconductor manufacturer has selected and installed an EVG850TB
fully automated temporary bonding system for high-volume processing of thin-
and ultra-thin device wafers.
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Ultra-thin Wafer Handling Solution Introduced by Brewer Science and EV Group
July 16, 2007 - EV Group, and Brewer Science,
Inc., announce that they have introduced a new system and offer new
capabilities and yield performance for UltraThin Wafer Processing.
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EV Group Signs Contract with SemiProbe for Worldwide Distribution of Wafer Probing Systems
July 10, 2007 - EV Group today announced that it has
signed a distribution agreement with SemiProbe a leading supplier of wafer
level probing systems.
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Customers Rank EVG in 10 BEST for 5 Years Consecutively in the VLSI Research Wafer Processing Equipment Customer Satisfaction Survey
June 26, 2007 - EV Group has been honored among the 10 BEST
in the category of Small Suppliers of Wafer Processing Equipment.
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Danchip Selects EVG620 Mask Aligner from EV Group
May 24, 2007 - EV Group has successfully installed an EVG620
Mask Aligner at DANCHIP.
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EV Group and GenISys Form Ongoing Development Collaboration on Advanced Mask Aligner Lithography Simulation for MEMS
February 7, 2007 - EV Group announced it has formed a
collaborative product development partnership with GenISys GmbH for the
development and marketing of a simulation platform for advanced mask aligner
lithography processes.
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EV Group and Sonix Inc. Begin Joint Cooperation and Sign Reseller Distribution Agreement
December 1, 2006 - EV Group and Sonix Inc.join forces as
Sonix selects EVG as their exclusive world wide reseller/distributor of
selected Sonix products.
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