EV Group highlights technology firsts, key advancements at Semicon West 2011 

Recent developments span 450mm wafer bonding, in-line metrology, growth in target markets, headquarters expansion, and industry and university collaborative R&D efforts. EV Group has seen an increase in order intake in fiscal 2011 of approximately 40 percent compared with fiscal 2010, and will break ground this month on an expansion that will more than double its manufacturing floor space. EVG credits these successes to its ongoing focus on development and innovation within its target markets.

Industry-first capabilities point to innovation

The most recent breakthrough was the announcement of the EVG850SOI/450mm – the first-ever wafer bonding system for 450mm-diameter semiconductor wafers manufactured from silicon-on-insulator (SOI) substrates. The new system, arising out of EVG’s advanced 450mm program, was developed to facilitate the industry shift to 450mm wafers from the current 300mm standard, and is optimized for SOI because it delivers better power/performance for sub-22 nm CMOS and 3D technologies compared to similar-geometry bulk CMOS. In addition, the new EVG bonder can continue to accommodate 300mm wafers during the transition period.  SOI leader Soitec will receive shipment of the first system, providing testing and qualification to speed production readiness.

Another first for EVG was the addition of an in-line metrology capability to its EVG850TB and EVG850DB automated temporary bonding and debonding platforms. Integrating these technologies together helps ensure detection of a variety of process irregularities and defects during bonding/debonding – ultimately, helping to optimize customers’ wafer-thinning and bonding processes, reduce tool downtime resulting from processing yield issues, and maximize product yields and investments . Adding in-line metrology to thin-wafer processing is particularly crucial in helping to enable the ramp-up of 3D IC and through-silicon via (TSV) manufacture from pilot to volume production.

Collaborations and consortia help drive advancements

As the aforementioned innovations illustrate, EVG continues to take a leading role in driving 3D market evolution. In addition to having recently added several new customers in this arena, the company last week announced its engagement with the Georgia Institute of Technology 3D SystemsPackagingResearchCenter (GT PRC) . Through its membership, EVG’s state-of-the-art temporary bonding and debonding, chip-to-wafer bonding and lithography technology and associated product and process expertise will be incorporated into the PRC’s Silicon and Glass Interposer Industry (SiGI) Consortium research program.

Another core technology focus for EVG is the MEMS arena. In late June, EVG announced that its Gemini fully automated wafer-bonding system will be installed at Quebec’s MiQro Innovation Collaborative Centre (C2MI) , a partnership between Université de Sherbrooke, Teledyne DALSA and IBM Canada. The GEMINI system will be used to develop products that demonstrate advanced packaging of MEMS devices and full integration of CMOS and MEMS devices, with the end goal of successful transfer to high-volume manufacturing (HVM) scenarios.

As a strong proponent of education and early development of next-generation technologists, EVG has undertaken a sponsorship of SEMI High Tech U, an industry-driven math and science-based career exploration program created by the non-profit SEMI Foundation to support education and career awareness in high-technology fields. Its support will enable EVG to impact SEMI High Tech U’s curriculum (which is designed to help students “make the connection” between the classroom and the real world of high tech) by meeting and collaborating with higher-learning institutions.

Corporate growth supports recent developments

The recent greater-than-expected uptick in orders – approximately 40% increase in order intake in fiscal 2011 compared with an already strong fiscal 2010 - underscores customers’ continued confidence in EVG’s innovation, technology leadership, and product and service quality. It also serves to validate the need for the ongoing expansion of EVG headquarters. Set to break ground this month and completed by year end, EVG will modernize and more than double the space of its manufacturing floor and improve logistical processes, while continuing to invest additional capacity for its machining center and new manufacturing technologies.

EVG will be exhibiting and presenting at SEMICON West. In fact, EVG’s Markus Wimplinger, corporate technology development and IP director, will speak on “In-line IR metrology for high-volume temporary bonding applications” at the SEMATECH Workshop on 3D Interconnect Technology, Wed., July 13^th . 

EVG Presentations at SEMICON West 2011:

MCA BrightSpots 450-mm Forum
Will a “Super-sized” Wafer Make Cents or Sense?
Paul Lindner, Executive Technology Director, EV Group is a panelist at an online forum which started with a live panel event on Monday, July 11 immediately prior to SEMICON West. To listen to the live panel discussion podcast, view interviews with Paul Lindner and other thought leaders from throughout the semiconductor manufacturing industry, and to follow or partake in the active discussion exploring the key issues surrounding the transition to the next semiconductor wafer size, click here .

SEMATECH Workshop on 3D Interconnect Metrology
EVG Presentation: In-line IR Metrology for High-Volume Temporary Bonding Applications
Markus Wimplinger, Corporate Technology Development & IP Director, EV Group'
Wed, July 13, 1:40 – 2:00 PM, San Francisco Marriott Marquis
To register click here.

 

More Lumens per Dollar: Issues and Answers to Bring Costs Down to Create a General Lighting Market
Afternoon Session  Moderator: Ron Miller, Nano Imprint Lithography Business Development and External R&D Programs Manager, EV Group
Wed, July 13, 2:00 - 4:20 PM South Hall, Moscone Center