EV Group launches new flagship model in its GEMINI FB range, and highlights the latest MEMS and LED technology developments at SEMICON TAIWAN 2011
The new GEMINI®FB platform extension increases the throughput of EV Group’s field-proven, automated fusion wafer bonding systems up to 20 wafers per hour. Enhanced automation capabilities enable customers to achieve higher levels of manufacturing efficiency for such applications as backside illuminated (BSI) CMOS image sensors, 3D integration of CMOS image sensors, and monolithic 3D integration of memory devices. Read more...
Other recent developments span 450 mm wafer bonding, in-line metrology, growth in target markets, headquarters expansion, and industry and university collaborative R&D efforts. EV Group has seen an increase in order intake in fiscal 2011 of approximately 40 percent compared with fiscal 2010. The company broke ground this Summer on an expansion that will more than double its manufacturing floor space. EVG credits these successes to its ongoing focus on development and innovation within its target markets. Read more...
EVG Presentations at SEMICON Taiwan 2011:
SEMICON Taiwan 2011 Innovative Technology Center - MEMS Session
EVG Presentation: Advanced Lithography and Inspection Solutions for 3D TSV Packaging of MEMS Devices
Markus Wimplinger, Corporate Technology Development & IP Director, EV Group
Wednesday September 7th, 13:00 MEMS Session, Innovation Technology Center
SEMICON Taiwan 2011 Innovative Technology Center - LED Session
EVG Presentation: High Throughput Lithography and Bonding Technology for LED Manufacturing
Markus Wimplinger, Corporate Technology Development & IP Director, EV Group
Thursday September 8th, 13:00 LED Session, Innovation Technology Center
SEMICON Taiwan 2011 MEMS Forum
EVG Presentation: Equipment and Process Technology for Oxide-to-Oxide and Metal Bonding for High Volume Manufacturing of Miniaturized MEMS Devices for Mobile Applications
Markus Wimplinger, Corporate Technology Development & IP Director, EV Group
Thursday September 8th, 15:40, MEMS Forum
SEMATECH Meeting: SEMICON Taiwan 3DS-IC Temporary Bonding Technology Workshop
EVG Presentation: Temporary Bonding: HVM Concerns
Markus Wimplinger, Corporate Technology Development & IP Director, EV Group
Friday September 9th, 13:30, Sheraton Hsinchu Hotel