EV Group shares key highlights and developments at SEMICON China 2010:

At SEMICON China, the company highlights key products and solutions targeted at the Advanced Packaging & 3D Interconnect, Compound Semiconductor and Silicon-Based Power Devices, MEMS, Nanotechnology, and SOI markets.

EV Group presents the latest solutions for 3D Integration and TSV:
-  Lithography for 3D-ICs and CMOS image sensors
-  Wafer-to-wafer and chip-to-wafer bonding
-  Temporary bonding and de-bonding for thin wafer processing

The shift to smaller geometries along with more feature-dense packages adds a host of challenges, surrounding precision alignment capabilities, which can greatly impact device failure intolerance and, ultimately, yield and cost. To address increased demand for higher precision alignment accuracy, EV Group has introduced the new NT series, an already field-proven suite of mask aligners, wafer-to-wafer (W2W) bond aligners and measurement systems. The NT Series offers dramatically increased alignment accuracy—in the range of 1 µm down to 0.1 µm—for the manufacture of advanced MEMS, compound semiconductor, silicon-based power, 3D IC and nanotechnology devices—unlike anything else on the market.  Several new NT systems have already been installed at customer sites worldwide and passed the acceptance tests.

Dedicated manufacturing solutions for the wafer-level camera market:
EV Group has launched the EVG®770 Gen II NIL Stepper – a new, flagship solution for nanoimprint lithography (NIL). Implementing a unique step and repeat imprinting approach, the new system addresses large-area master fabrication for optical applications and replication of high-resolution features for nanooptics and nanoelectronics. As the first-of-its-kind UV-based NIL step and repeat system for micro optics, the EVG770 GEN II supports applications such as micro-lens molding for CMOS image sensors and wafer-level cameras. The system augments single-step processes, and enables the creation of lens masters for working stamp fabrication and subsequent full-wafer lens micro-molding.  Other applications utilizing high-resolution features include for example the manufacturing of waveguides, ring resonators and R&D for nanoelectronic applications (i.e., dual damascene and contact holes). The EVG770 GEN II step and repeat system supports hard and soft UV-NIL as well as micro-contact printing applications for wafer sizes ranging from 100 to 300 mm. The system supports semi- and fully-automated wafer and template transfer.

Soft UV Imprint Lithography is a highly parallel technique for the fabrication of polymeric microlenses, the key elements of wafer level optical systems. Starting out from soft working stamps replicated from wafer-size master stamps, EV Group offers single and double side microlens molding processes which can be easily adapted to various material combinations for working stamp and microlens materials. In addition, EV Group offers a qualified microlens molding process including all relevant material know-how. The IQ Aligner® UV-NIL System, the industry leading tool for wafer-level optics production with many installations at leading wafer-level camera manufacturers worldwide, allows for micromolding and nanoimprinting processes with stamps and wafers from 150 mm to 300mm diameter. Uniform contact force for high yield large area printing is provided by EV Group's proprietary chuck design which supports both soft and hard stamps. EVG’s unique, fully automated de-embossing function provides a release mechanism for stamps from imprinted substrates. The ultimate micro optics stack is fabricated by UV bonding of all elements, including individual double side microlens wafers as well as spacer wafers required to achieve the final stack height. Aligned UV Bonding can be performed on the IQ Aligner itself, as well as on other bonding systems including EV Group’s fully integrated and highly automated GEMINI® production wafer bonding systems.