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Featured upcoming events
Strategies in Light 2012
February 07 - 09, 2012, Santa Clara, CA
Visit our presentation "High Throughput Lithography and Metal Wafer Bonding: Two Enabling Technologies for Future High-Brightness LEDs" at the "LED Manufacturing Conference" at
Strategies in Light 2012.
ICONN 2012
February 05 - 09, 2012, Perth, WA Australia
Visit our booth # 87 and our presentation entitled "Nanoimprint Lithography - From R&D to High Volume Applications" at
ICONN 2012.
Semicon Korea 2012
February, 07- 09, 2012, Seoul, Korea
Visit our booth #1244 in Hall C (3F) and EVG's presentation entitled "Equipment Process Technology for Oxide-to-Oxide and Metal Bonding for High Volume Manufacturing of Miniaturized MEMS devices for Mobile Applications" at the MEMS TechXPOT at
SEMICON Korea 2012.
CS Europe 2012
March 12 - 13, 2012, Frankfurt, Germany
Visit our booth and EVG's presentation "Temporary Bonding: An enabling technology for RF and power compound semiconductor devices" at
CS Europe 2012.
CSTIC 2012
March 18 - 19, 2012, Shanghai, China
Visit our presentation entitled "Wafer Bonding for Backside Illuminated Image Sensors" at
CSTIC 2012.
Semicon China 2012
March, 20 - 22, 2012, Shanghai, China
Visit our booth in Hall E3, Booth # 3015 at
SEMICON China 2012.
MiNaPAD 2012
April 25 - 26, 2012, Grenoble, France
Visit our booth # 16 at
MiNaPAD 2012.
CS MANTECH 2012
April 23 - 26, 2012, Boston, Massachusetts, USA
Visit our paper presentation at
CS MANTECH 2012.