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History

1980

Founding of EV Group (formerly known as Electronic Visions Co.) by Erich and Aya Maria Thallner

1985

EV Group created the world´s first double side mask aligner with bottom side microscope

1990

Invention of the process separation between wafer alignment and wafer bonding

1992

First production wafer bonding systems for volume MEMS production were provided, based on the process separation between wafer alignment and wafer bonding

1994

Founding of EV Group in Phoenix, USA

Installation of the first automated SOI wafer bonder

1997

Headquarters building expansion

Founding of EV Group in Yokohama, Japan

Development of the first nanoimprinting system

1998

Development of the OmniSpray® cavity coating technology

1999

Introduction of the SmartView® wafer-to-wafer alignment system

2000

Founding of EV Group in Cranston, USA

Headquarters building and manufacturing floor expansion

Integrated production systems Gemini® and Hercules® were introduced

First hot embossing system for BioMEMS and microfluidics applications shipped

Celebration of the 20-year anniversary event

2001

70% headquarters building and manufacturing floor expansion

Installation of the first 300 mm automated SOI production bonder

Introduction of the first temporary bonding and debonding systems

EV Group entered the Chinese market with two sales representations

2002

The new 300 mm automated IQ Aligner® was introduced

First 300 mm production wafer bonding system and 300 mm SmartView® wafer-to-wafer bond aligner

Several further 300 mm tool sets

2003

Founding of EVG-Jointech in Taiwan (Chung-Li)

SmartEdge® wafer edge inspection system was introduced

EV Group announced LowTemp plasma bonding

2004

Introduced Chip-to-Wafer bonding system, EVG®6200 Infinity mask aligner and EVG®570PMI nanoimprint lithography system for data storage applications

2005

Launch of new EVG520IS Wafer Bonding System

Relocation and opening of new EVG North America Headquarters

Celebration of 25th Company Anniversary

2006

Development of new Nano Spray Coating Technology

Introduction of EVG´s online shop: www.EVGTshop.com

2007

Manufacturing Systems for Hot Embossing

Manufacturing Systems for double-side UV-NIL

Coating systems for flexible organic displays

   SEE ALSO:

NanoAlign Technology


LowTemp Plasma Bonding


Advanced-chip-to-wafer Technology (AC2W)


VLSI 10BEST 2007

 
   
   
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