http://www.evgroup.com/feeds/products3EVG Products1http://www.evgroup.com/zh/products/lithography/12/28/2011 4:52:22 PMSteininger JudithSection2http://www.evgroup.com/zh/products/bonding/temporary_bonding/xtframe/12/6/2011 11:05:24 AMSteininger JudithSection3http://www.evgroup.com/zh/products/bonding/temporary_bonding/zonebond/The EVG850DB Automated Debonding System is designed for automated debonding of device wafer from the carrier substrate.11/25/2011 8:44:06 AMSteininger JudithSection4http://www.evgroup.com/zh/products/bonding/soi_bonding/11/8/2011 1:42:11 PMKinz LisaSection5http://www.evgroup.com/zh/products/bonding/temporary_bonding/10/28/2011 9:18:11 AMSteininger JudithSection6http://www.evgroup.com/zh/products/bonding/integrated_bonding/geminifb/EV Group's GEMINIFB provides a fully automated and integrated platform for wafer-to-wafer alignment and wafer bonding.10/11/2011 6:48:47 AMKinz LisaSection7http://www.evgroup.com/zh/products/bonding/waferbonding/9/13/2011 9:20:56 AMHaslinger SiegfriedSection8http://www.evgroup.com/zh/services/evg_application_lab/7/28/2011 2:54:23 PMSteininger JudithSection9http://www.evgroup.com/zh/products/lithography/mask_aligners/evg620hbl/Dedicated, fully automated mask aligner system for high volume manufacturing of High-Brightness LEDs (HB-LEDs), compound semiconductors and power electronics.2/23/2011 6:47:11 AMKinz LisaSection10http://www.evgroup.com/zh/products/lithography/nil_systems/iqaligneruvnil/The IQ Aligner Automated UV-NIL, µ-CP System allows for micromolding and nanoimprinting processes with stamps and wafers from 150 mm to 300mm diameter.12/1/2010 2:29:06 PMKinz LisaSection11http://www.evgroup.com/zh/products/bonding/waferbonding/evg520l3/EVG®520L3 Semi-Automated High-Vacuum Wafer Bonding System10/19/2010 2:06:19 PMSteininger JudithSection12http://www.evgroup.com/zh/products/bonding/waferbonding/evg540/The EVG540 is an automated single-chamber production bonder designed for pilot line and manufacturing as well as R&D for high volume manufacturing in Wafer Level Packaging, 3D-Interconnect and MEMS applications.10/19/2010 12:30:47 PMKinz LisaSection13http://www.evgroup.com/zh/products/lithography/mask_aligners/evg6200nt/Known for its high level of automation and reliability, the EVG®6200NT Automated Mask Alignment System is designed for wafer-to-wafer alignment up to 200 mm wafer sizes.10/19/2010 12:30:19 PMKinz LisaSection14http://www.evgroup.com/zh/products/bonding/integrated_bonding/gemini/10/18/2010 1:17:25 PMKinz LisaSection15http://www.evgroup.com/zh/products/lithography/nil_systems/10/18/2010 12:45:56 PMKinz LisaSection16http://www.evgroup.com/zh/products/bonding/soi_bonding/evg301/The EVG300 series single wafer cleaning systems are designed for efficient removal of particles. In semiconductor processing, efficient cleaning and particles removal prior to critical process steps enables maximum yield.9/29/2010 7:39:03 AMKinz LisaSection17http://www.evgroup.com/zh/products/bonding/waferbonding/evg520is/The EVG520IS is configurable for all wafer bonding processes such as anodic, thermo compression, fusion bonding, or LowTemp plasma bonding.9/23/2010 1:12:57 PMKinz LisaSection18http://www.evgroup.com/zh/products/lithography/mask_aligners/evg6200maskaligner/With full field proximity exposure of very thick resist layers, the EVG6200 Infinity targets wafer bumping and chip scale packaging markets as well as applications in MEMS, Compound Semiconductor, Power Devices and Nanotechnology." 9/23/2010 1:12:10 PMKinz LisaSection19http://www.evgroup.com/zh/products/lithography/mask_aligners/evg610maskalignment/EVG610 is a R&D Mask Alignment System that can handle small substrate pieces and wafers up to 200 mm.8/27/2010 7:25:35 AMKinz LisaSection20http://www.evgroup.com/zh/products/bonding/integrated_bonding/8/19/2010 11:22:27 AMKinz LisaSection