http://www.evgroup.com/feeds/products3EVG Products1http://www.evgroup.com/zh/products/lithography/mask_aligners/evg610maskalignment/?version=1EVG610 is a R&D Mask Alignment System that can handle small substrate pieces and wafers up to 200 mm.7/12/2010 2:12:22 PMKinz LisaSection2http://www.evgroup.com/zh/products/bonding/waferbonding/evg560hbl/?version=1The EVG560 HBL is a dedicated, fully automated wafer bonding system for High-Brightness LED (HB-LED) manufacturing.7/12/2010 2:02:36 PMKinz LisaSection3http://www.evgroup.com/zh/services/evg_application_lab/?version=17/7/2010 6:48:12 AMSteininger JudithSection4http://www.evgroup.com/zh/products/bonding/temporary_bonding/?version=11/8/2010 7:30:40 AMKinz LisaSection5http://www.evgroup.com/zh/products/lithography/nil_systems/?version=111/13/2009 10:56:02 AMReiter AnnaSection6http://www.evgroup.com/zh/products/lithography/nil_systems/iqaligneruvnil/?version=1The IQ Aligner Automated UV-NIL, µ-CP System allows for micromolding and nanoimprinting processes with stamps and wafers from 150 mm to 300mm diameter.11/13/2009 10:48:40 AMReiter AnnaSection7http://www.evgroup.com/zh/products/lithography/mask_aligners/lithography_iq_aligner/?version=1The IQ Aligner is based on a field-proven, robust design with up to 300 mm wafer size capability, full-field exposure, single and double-side alignment, large gap and dark field mask alignment.11/13/2009 10:44:42 AMReiter AnnaSection8http://www.evgroup.com/zh/products/lithography/mask_aligners/evg620semiauto/?version=1Automated Mask Alignment System designed for optical double-side lithography. Volume production types and manual R&D systems are available." 11/13/2009 10:44:16 AMReiter AnnaSection9http://www.evgroup.com/zh/products/lithography/mask_aligners/?version=111/13/2009 10:44:11 AMReiter AnnaSection10http://www.evgroup.com/zh/products/bonding/integrated_bonding/?version=111/13/2009 10:16:19 AMReiter AnnaSection11http://www.evgroup.com/zh/products/bonding/waferbonding/?version=111/13/2009 10:08:46 AMReiter AnnaSection12http://www.evgroup.com/zh/products/bonding/bondalignment/?version=111/13/2009 9:45:59 AMReiter AnnaSection13http://www.evgroup.com/zh/products/bonding/?version=111/13/2009 9:45:55 AMReiter AnnaSection14http://www.evgroup.com/zh/products/bonding/bondalignment/smartviewnt/?version=1For wafer-to-wafer alignment via alignment keys in bond interface. 11/12/2009 11:42:00 AMHaslinger SiegfriedSection15http://www.evgroup.com/zh/products/bonding/integrated_bonding/geminifb/?version=1EV Group's GEMINIFB provides a fully automated and integrated platform for wafer-to-wafer alignment and wafer bonding.10/19/2009 12:28:12 PMAuinger Maria GerlindeSection16http://www.evgroup.com/zh/products/lithography/inspection_systems/evg40/?version=1EV Group offers systems for highly accurate destruction-free alignment accuracy measurements designed for all processes that involve double sided lithography.9/30/2009 7:54:43 AMAuinger Maria GerlindeSection17http://www.evgroup.com/zh/products/bonding/bondalignment/smartview/?version=1The SmartView Alignment System offers a proprietary method for micron level face-to-face wafer level alignment9/30/2009 7:45:42 AMAuinger Maria GerlindeSection18http://www.evgroup.com/zh/products/bonding/soi_bonding/evg850prod/?version=1The EVG850 is designed to fulfill a wide range of fusion wafer bonding applications, with main focus on SOI substrates manufacturing. The EVG850 is the only production bonding system built to operate in high throughput, high-yield environments.9/30/2009 7:38:59 AMAuinger Maria GerlindeSection19http://www.evgroup.com/zh/products/lithography/coaters_developers/?version=19/29/2009 1:00:32 PMAuinger Maria GerlindeSection20http://www.evgroup.com/zh/products/bonding/temporary_bonding/evg850tb/?version=1The EVG850TB bonds compound semiconductor wafers to sapphire, quartz or silicon carriers by use of dry film, spin-on adhesives, or wax.9/1/2009 8:14:56 AMStieger ManuelaSection