EVG Productshttp://www.evgroup.com/feeds/products2EVG Products1리소그라피http://www.evgroup.com/ko/products/lithography/12/28/2011 4:51:55 PMSteininger JudithSection2XT Frame Systemhttp://www.evgroup.com/ko/products/bonding/temporary_bonding/xtframe/12/6/2011 10:53:07 AMSteininger JudithSection3ZoneBOND(TM) Process Moduleshttp://www.evgroup.com/ko/products/bonding/temporary_bonding/zonebond/The EVG850DB Automated Debonding System is designed for automated debonding of device wafer from the carrier substrate.11/28/2011 12:34:40 PMSteininger JudithSection4SOI 본더http://www.evgroup.com/ko/products/bonding/soi_bonding/11/8/2011 1:41:41 PMKinz LisaSection5Temporary Bonding and Debonding Systemhttp://www.evgroup.com/ko/products/bonding/temporary_bonding/10/28/2011 9:17:25 AMSteininger JudithSection6GEMINIFB® Production Fusion Bonding Systemhttp://www.evgroup.com/ko/products/bonding/integrated_bonding/geminifb/EV Group's GEMINIFB provides a fully automated and integrated platform for wafer-to-wafer alignment and wafer bonding.10/11/2011 6:48:18 AMKinz LisaSection7웨이퍼본더http://www.evgroup.com/ko/products/bonding/waferbonding/9/13/2011 9:21:51 AMHaslinger SiegfriedSection8공정기술http://www.evgroup.com/ko/services/evg_application_lab/7/28/2011 2:56:38 PMSteininger JudithSection9EVG®620HBL Automated Mask Alignment System for HB-LEDhttp://www.evgroup.com/ko/products/lithography/mask_aligners/evg620hbl/Dedicated, fully automated mask aligner system for high volume manufacturing of High-Brightness LEDs (HB-LEDs), compound semiconductors and power electronics.2/23/2011 6:46:37 AMKinz LisaSection10검사장비http://www.evgroup.com/ko/products/bonding/inspectionsystems/1/12/2011 8:57:23 AMSteininger JudithSection11통합형본더http://www.evgroup.com/ko/products/bonding/integrated_bonding/1/12/2011 8:55:24 AMSteininger JudithSection12본딩얼라이너http://www.evgroup.com/ko/products/bonding/bondalignment/1/12/2011 8:55:12 AMSteininger JudithSection13검사장비http://www.evgroup.com/ko/products/lithography/inspection_systems/1/12/2011 8:53:54 AMSteininger JudithSection14<p>나노임프린트 리소그라피 </p> <p>(UV-NIL, µCP, HE)<p>http://www.evgroup.com/ko/products/lithography/nil_systems/1/12/2011 8:53:11 AMSteininger JudithSection15리소그라피 트랙장비http://www.evgroup.com/ko/products/lithography/lithography_track_systems/1/12/2011 8:51:35 AMSteininger JudithSection16레지스트공정http://www.evgroup.com/ko/products/lithography/coaters_developers/1/12/2011 8:51:22 AMSteininger JudithSection17마스크얼라이너http://www.evgroup.com/ko/products/lithography/mask_aligners/1/12/2011 8:51:01 AMSteininger JudithSection18IQ Aligner® Automated UV-NIL, µ-CP Systemhttp://www.evgroup.com/ko/products/lithography/nil_systems/iqaligneruvnil/The IQ Aligner Automated UV-NIL, µ-CP System allows for micromolding and nanoimprinting processes with stamps and wafers from 150 mm to 300mm diameter. 12/1/2010 2:28:23 PMKinz LisaSection19EVG®520L3 Semi-Automated Wafer Bonding Systemhttp://www.evgroup.com/ko/products/bonding/waferbonding/evg520l3/EVG®520L3 Semi-Automated High-Vacuum Wafer Bonding System10/19/2010 2:06:51 PMSteininger JudithSection20EVG®540 Automated Wafer Bonding Systemhttp://www.evgroup.com/ko/products/bonding/waferbonding/evg540/The EVG540 is an automated single-chamber production bonder designed for pilot line and manufacturing as well as R&D for high volume manufacturing in Wafer Level Packaging, 3D-Interconnect and MEMS applications.10/19/2010 12:29:17 PMKinz LisaSection