<?xml version="1.0" encoding="UTF-8"?><rss version="2.0"><channel><title>EVG Products</title><link>http://www.evgroup.com/feeds/products11</link><description>EVG Products</description><item><id>1</id><title>EVG®610 Mask Alignment System</title><link>http://www.evgroup.com/ja/products/lithography/mask_aligners/evg610maskalignment1/?version=1</link><description>EVG610 is a R&amp;D Mask Alignment System that can handle small substrate pieces and wafers up to 200 mm.</description><pubDate>7/12/2010 2:10:17 PM</pubDate><author>Kinz Lisa</author><type>Section</type></item><item><id>2</id><title>EVG®560HBL Fully automated wafer bonding system for HB-LED</title><link>http://www.evgroup.com/ja/products/bonding/waferbonding/evg560hbl/?version=1</link><description>The EVG560 HBL is a dedicated, fully automated wafer bonding system for High-Brightness LED (HB-LED) manufacturing.</description><pubDate>7/12/2010 1:57:18 PM</pubDate><author>Kinz Lisa</author><type>Section</type></item><item><id>3</id><title>テンポラリーボンダー/剥離装置</title><link>http://www.evgroup.com/ja/products/bonding/temporary_bonding/?version=1</link><description /><pubDate>1/8/2010 7:28:58 AM</pubDate><author>Kinz Lisa</author><type>Section</type></item><item><id>4</id><title>EVG®320 Automated Single Wafer Cleaner</title><link>http://www.evgroup.com/ja/products/bonding/soi_bonding/evg320/?version=1</link><description>The EVG320 Automated Single Wafer Cleaner is designed for efficient removal of particles prior to critical process steps in semiconductor processing.</description><pubDate>11/16/2009 9:39:13 AM</pubDate><author>Haslinger Siegfried</author><type>Section</type></item><item><id>5</id><title>&lt;p&gt;UV-NIL　/&lt;/p&gt;
&lt;p&gt;マイクロコンタクトプリンティング&lt;/p&gt;</title><link>http://www.evgroup.com/ja/products/lithography/nil_systems/?version=1</link><description /><pubDate>11/13/2009 10:50:17 AM</pubDate><author>Reiter Anna</author><type>Section</type></item><item><id>6</id><title>IQ Aligner® Automated UV-NIL, µ-CP System</title><link>http://www.evgroup.com/ja/products/lithography/nil_systems/iqaligneruvnil/?version=1</link><description>The IQ Aligner automated double-side UV-NIL system allows for micromolding and nanoimprinting processes with stamps and wafers from 150 mm to 300mm diameter. </description><pubDate>11/13/2009 10:47:59 AM</pubDate><author>Reiter Anna</author><type>Section</type></item><item><id>7</id><title>EVG®620 全自動マスクアライナー</title><link>http://www.evgroup.com/ja/products/lithography/mask_aligners/evg620semiauto/?version=1</link><description>マスクアライナーは光学両面リソグラフィ用にデザインされており、R&amp;Dから量産機までお客様のニーズに合わせた製品を取り揃えております。</description><pubDate>11/13/2009 10:43:29 AM</pubDate><author>Reiter Anna</author><type>Section</type></item><item><id>8</id><title>統合型ボンダー</title><link>http://www.evgroup.com/ja/products/bonding/integrated_bonding/?version=1</link><description /><pubDate>11/13/2009 10:15:35 AM</pubDate><author>Reiter Anna</author><type>Section</type></item><item><id>9</id><title>ウェーハボンダー</title><link>http://www.evgroup.com/ja/products/bonding/waferbonding/?version=1</link><description /><pubDate>11/13/2009 10:07:57 AM</pubDate><author>Reiter Anna</author><type>Section</type></item><item><id>10</id><title>ボンディング</title><link>http://www.evgroup.com/ja/products/bonding/?version=1</link><description /><pubDate>11/13/2009 9:46:27 AM</pubDate><author>Reiter Anna</author><type>Section</type></item><item><id>11</id><title>GEMINIFB® Production Fusion Bonding System</title><link>http://www.evgroup.com/ja/products/bonding/integrated_bonding/geminifb/?version=1</link><description>EV Group's GEMINIFB provides a fully automated and integrated platform for wafer-to-wafer alignment and wafer bonding.</description><pubDate>10/19/2009 12:18:06 PM</pubDate><author>Auinger Maria Gerlinde</author><type>Section</type></item><item><id>12</id><title>マスクアライナー</title><link>http://www.evgroup.com/ja/products/lithography/mask_aligners/?version=1</link><description /><pubDate>10/8/2009 3:49:22 PM</pubDate><author>Auinger Maria Gerlinde</author><type>Section</type></item><item><id>13</id><title>プロセス技術</title><link>http://www.evgroup.com/ja/services/evg_application_lab/?version=1</link><description /><pubDate>10/7/2009 8:41:50 AM</pubDate><author>Auinger Maria Gerlinde</author><type>Section</type></item><item><id>14</id><title>EVG®40 Top-to-bottom side Measurement System</title><link>http://www.evgroup.com/ja/products/lithography/inspection_systems/evg40/?version=1</link><description>EV Group offers systems for highly accurate destruction-free alignment accuracy measurements designed for all processes that involve double sided lithography.</description><pubDate>9/30/2009 7:50:18 AM</pubDate><author>Auinger Maria Gerlinde</author><type>Section</type></item><item><id>15</id><title>SmartView®NT Bond Alignment System for Universal Alignment </title><link>http://www.evgroup.com/ja/products/bonding/bondalignment/smartviewnt/?version=1</link><description>For wafer-to-wafer alignment via alignment keys in bond interface. </description><pubDate>9/30/2009 7:43:38 AM</pubDate><author>Auinger Maria Gerlinde</author><type>Section</type></item><item><id>16</id><title>SmartView® Bond Alignment System for Universal Alignment </title><link>http://www.evgroup.com/ja/products/bonding/bondalignment/smartview/?version=1</link><description>The SmartView Aligner offers a proprietary method for micron level face-to-face wafer level alignment.</description><pubDate>9/30/2009 7:42:57 AM</pubDate><author>Auinger Maria Gerlinde</author><type>Section</type></item><item><id>17</id><title>EVG®850 Automated Production Bonding System for SOI </title><link>http://www.evgroup.com/ja/products/bonding/soi_bonding/evg850prod/?version=1</link><description>The EVG850 is designed to fulfill a wide range of fusion wafer bonding applications, with main focus on SOI substrates manufacturing. The EVG850 is the only production bonding system built to operate in high throughput, high-yield environments.</description><pubDate>9/30/2009 7:38:27 AM</pubDate><author>Auinger Maria Gerlinde</author><type>Section</type></item><item><id>18</id><title>EVG®850DB Automated Debonder</title><link>http://www.evgroup.com/ja/products/bonding/temporary_bonding/evg850autodebond/?version=1</link><description>The EVG850DB Automated Debonder is designed for automated debonding of device wafer from the carrier substrate.</description><pubDate>9/1/2009 8:13:27 AM</pubDate><author>Stieger Manuela</author><type>Section</type></item><item><id>19</id><title>EVG®850TB Automated Temporary Bonder</title><link>http://www.evgroup.com/ja/products/bonding/temporary_bonding/evg850autotemp/?version=1</link><description>The EVG850TB bonds compound semiconductor wafers to sapphire, quartz or silicon carriers by use of dry film, spin-on adhesives, or wax.</description><pubDate>9/1/2009 8:13:12 AM</pubDate><author>Stieger Manuela</author><type>Section</type></item><item><id>20</id><title>EVG®6200∞ Automated UV-NIL, µ-CP System</title><link>http://www.evgroup.com/ja/products/lithography/nil_systems/evg6200_uv-nil/?version=1</link><description>The EVG6200 Automated UV-NIL, µ-CP System is designed for For pattern creation in UV-curable materials from a prestructured stamp to a substrate.</description><pubDate>9/1/2009 8:02:51 AM</pubDate><author>Stieger Manuela</author><type>Section</type></item></channel></rss>