<?xml version="1.0" encoding="UTF-8"?><rss version="2.0"><channel><title>EVG Products</title><link>http://www.evgroup.com/feeds/products11</link><description>EVG Products</description><item><id>1</id><title>リソグラフィ</title><link>http://www.evgroup.com/ja/products/lithography/</link><description /><pubDate>12/28/2011 4:51:34 PM</pubDate><author>Steininger Judith</author><type>Section</type></item><item><id>2</id><title>XT Frame System</title><link>http://www.evgroup.com/ja/products/bonding/temporary_bonding/xtframe/</link><description /><pubDate>12/6/2011 10:55:20 AM</pubDate><author>Steininger Judith</author><type>Section</type></item><item><id>3</id><title>ZoneBOND(TM) Process Modules</title><link>http://www.evgroup.com/ja/products/bonding/temporary_bonding/zonebond/</link><description>The EVG850DB Automated Debonding System is designed for automated debonding of device wafer from the carrier substrate.</description><pubDate>11/28/2011 12:38:50 PM</pubDate><author>Steininger Judith</author><type>Section</type></item><item><id>4</id><title>SOIボンダー</title><link>http://www.evgroup.com/ja/products/bonding/soi_bonding/</link><description /><pubDate>11/8/2011 1:41:13 PM</pubDate><author>Kinz Lisa</author><type>Section</type></item><item><id>5</id><title>テンポラリーボンダー/剥離装置</title><link>http://www.evgroup.com/ja/products/bonding/temporary_bonding/</link><description /><pubDate>10/28/2011 9:16:51 AM</pubDate><author>Steininger Judith</author><type>Section</type></item><item><id>6</id><title>GEMINIFB® Production Fusion Bonding System</title><link>http://www.evgroup.com/ja/products/bonding/integrated_bonding/geminifb/</link><description>EV Group's GEMINIFB provides a fully automated and integrated platform for wafer-to-wafer alignment and wafer bonding.</description><pubDate>10/11/2011 6:47:22 AM</pubDate><author>Kinz Lisa</author><type>Section</type></item><item><id>7</id><title>プロセス技術</title><link>http://www.evgroup.com/ja/services/evg_application_lab/</link><description /><pubDate>9/13/2011 10:31:20 AM</pubDate><author>Haslinger Siegfried</author><type>Section</type></item><item><id>8</id><title>EVG®560HBL Fully automated wafer bonding system for HB-LED</title><link>http://www.evgroup.com/ja/products/bonding/waferbonding/evg560hbl/</link><description>The EVG560 HBL is a dedicated, fully automated wafer bonding system for High-Brightness LED (HB-LED) manufacturing.</description><pubDate>7/7/2011 7:23:39 AM</pubDate><author>Steininger Judith</author><type>Section</type></item><item><id>9</id><title>コーター/ディベロッパー</title><link>http://www.evgroup.com/ja/products/lithography/coaters_developers/</link><description /><pubDate>4/4/2011 12:01:13 PM</pubDate><author>Steininger Judith</author><type>Section</type></item><item><id>10</id><title>マスクアライナー</title><link>http://www.evgroup.com/ja/products/lithography/mask_aligners/</link><description /><pubDate>3/29/2011 10:29:54 AM</pubDate><author>Steininger Judith</author><type>Section</type></item><item><id>11</id><title>EVG®150 NanoSprayコーティングシステム</title><link>http://www.evgroup.com/ja/products/lithography/coaters_developers/evg150nanospray/</link><description>NanoSpray allows a new bandwidth of applications throughout many technologies in semiconductor processing markets</description><pubDate>3/28/2011 11:52:29 AM</pubDate><author>Steininger Judith</author><type>Section</type></item><item><id>12</id><title>EVG®150 全自動レジストプロセスシステム</title><link>http://www.evgroup.com/ja/products/lithography/coaters_developers/evg150resist/</link><description>Designed to provide the widest range of process variations, the EVG150 series' modularity accepts spin and spray coating, developing, bake and chill modules to suit your individual production requirements.</description><pubDate>3/28/2011 11:51:42 AM</pubDate><author>Steininger Judith</author><type>Section</type></item><item><id>13</id><title>EVG®120 全自動レジストプロセスシステム</title><link>http://www.evgroup.com/ja/products/lithography/coaters_developers/evg120/</link><description>The EVG120 is an economical tool for quality spin coating and develop processes, especially for standard photoresist applications</description><pubDate>3/28/2011 11:51:26 AM</pubDate><author>Steininger Judith</author><type>Section</type></item><item><id>14</id><title>EVG®101 大面積レジストコーティングシステム </title><link>http://www.evgroup.com/ja/products/lithography/coaters_developers/evg101coating/</link><description>The EVG101 large area coating system is designed for cost effective coating on large areas.</description><pubDate>3/28/2011 11:50:59 AM</pubDate><author>Steininger Judith</author><type>Section</type></item><item><id>15</id><title>EVG®101 レジストプロセスシステム</title><link>http://www.evgroup.com/ja/products/lithography/coaters_developers/evg101/</link><description>The EVG101 series perform R&amp;D type processes on a single chamber design, which is fully compatible with our automated systems.</description><pubDate>3/28/2011 11:35:12 AM</pubDate><author>Steininger Judith</author><type>Section</type></item><item><id>16</id><title>IQ Aligner® 全自動マスクアライナー</title><link>http://www.evgroup.com/ja/products/lithography/mask_aligners/lithography_iq_aligner/</link><description>The IQ Aligner is based on a field-proven, robust design with up to 300 mm wafer size capability, full-field exposure, single and double-side alignment, large gap and dark field mask alignment.</description><pubDate>3/28/2011 8:06:22 AM</pubDate><author>Steininger Judith</author><type>Section</type></item><item><id>17</id><title>EVG®6200NT 全自動マスクアライナー</title><link>http://www.evgroup.com/ja/products/lithography/mask_aligners/evg6200nt/</link><description>Known for its high level of automation and reliability, the EVG®6200NT bond aligner is designed for wafer-to-wafer alignment up to 200 mm wafer sizes.</description><pubDate>3/28/2011 8:06:04 AM</pubDate><author>Steininger Judith</author><type>Section</type></item><item><id>18</id><title>EVG®620NT 全自動マスクアライナー</title><link>http://www.evgroup.com/ja/products/lithography/mask_aligners/evg620nt/</link><description>Known for its high level of automation and reliability, the EVG®620NT bond aligner is designed for wafer-to-wafer alignment up to 150 mm wafer sizes.</description><pubDate>3/28/2011 8:05:47 AM</pubDate><author>Steininger Judith</author><type>Section</type></item><item><id>19</id><title>EVG®620HBL HB-LED用全自動マスクアライナー</title><link>http://www.evgroup.com/ja/products/lithography/mask_aligners/evg620hbl/</link><description>Dedicated, fully automated mask aligner system for high volume manufacturing of High-Brightness LEDs (HB-LEDs), compound semiconductors and power electronics.</description><pubDate>3/28/2011 8:05:24 AM</pubDate><author>Steininger Judith</author><type>Section</type></item><item><id>20</id><title>EVG®610 マスクアライナー</title><link>http://www.evgroup.com/ja/products/lithography/mask_aligners/evg610maskalignment/</link><description>EVG610 is a R&amp;D Mask Alignment System that can handle small substrate pieces and wafers up to 200 mm.</description><pubDate>3/28/2011 7:54:11 AM</pubDate><author>Steininger Judith</author><type>Section</type></item></channel></rss>
