http://www.evgroup.com/feeds/products1EVG Products1http://www.evgroup.com/de/products/lithography/nil_systems/iqaligneruvnil/The IQ Aligner automated double-side UV-NIL system allows for micromolding and nanoimprinting processes with stamps and wafers from 150 mm to 300mm diameter.3/27/2012 1:46:49 PMKinz LisaSection2http://www.evgroup.com/de/products/lithography/mask_aligners/evg620hbl_gen2/Dedicated, fully automated mask aligner system for high volume manufacturing of High-Brightness LEDs (HB-LEDs), compound semiconductors and power electronics.3/19/2012 12:31:54 PMSteininger JudithSection3http://www.evgroup.com/de/products/bonding/temporary_bonding/zonebond/3/16/2012 8:43:06 AMSteininger JudithSection4http://www.evgroup.com/de/products/bonding/soi_bonding/evg301/The EVG300 series single wafer cleaning systems are designed for efficient removal of particles. In semiconductor processing, efficient cleaning and particles removal prior to critical process steps enables maximum yield.3/8/2012 7:43:31 AMKinz LisaSection5http://www.evgroup.com/de/products/bonding/temporary_bonding/xtframe/2/21/2012 11:00:59 AMSteininger JudithSection6http://www.evgroup.com/de/products/bonding/temporary_bonding/1/19/2012 4:56:57 PMSteininger JudithSection7http://www.evgroup.com/de/products/lithography/12/28/2011 4:51:13 PMSteininger JudithSection8http://www.evgroup.com/de/products/bonding/soi_bonding/11/8/2011 1:40:11 PMKinz LisaSection9http://www.evgroup.com/de/products/bonding/integrated_bonding/geminifb/EV Group's GEMINIFB provides a fully automated and integrated platform for wafer-to-wafer alignment and wafer bonding.10/11/2011 6:45:58 AMKinz LisaSection10http://www.evgroup.com/de/products/bonding/waferbonding/9/13/2011 9:22:46 AMHaslinger SiegfriedSection11http://www.evgroup.com/de/services/evg_application_lab/7/28/2011 2:57:31 PMSteininger JudithSection12http://www.evgroup.com/de/products/bonding/soi_bonding/evg810/The EVG810LT LowTemp plasma activation system is a single chamber, stand-alone unit for SOI, MEMS, compound semiconductors and advanced substrate bonding.3/16/2011 7:15:44 AMKinz LisaSection13http://www.evgroup.com/de/products/bonding/waferbonding/evg520l3/EVG®520L3 Semi-Automated High-Vacuum Wafer Bonding System10/19/2010 2:07:58 PMSteininger JudithSection14http://www.evgroup.com/de/products/bonding/waferbonding/evg540/The EVG540 is an automated single-chamber production bonder designed for pilot line and manufacturing as well as R&D for high volume manufacturing in Wafer Level Packaging, 3D-Interconnect and MEMS applications.10/19/2010 12:24:50 PMKinz LisaSection15http://www.evgroup.com/de/products/lithography/mask_aligners/evg6200nt/Known for its high level of automation and reliability, the EVG®6200NT Automated Mask Alignment System is designed for wafer-to-wafer alignment up to 200 mm wafer sizes.10/19/2010 12:24:28 PMKinz LisaSection16http://www.evgroup.com/de/products/bonding/integrated_bonding/gemini/EV Group's GEMINI provides a fully automated and integrated platform for wafer-to-wafer alignment and wafer bonding.10/18/2010 1:14:12 PMKinz LisaSection17http://www.evgroup.com/de/products/lithography/nil_systems/10/18/2010 12:39:47 PMKinz LisaSection18http://www.evgroup.com/de/products/lithography/mask_aligners/evg6200maskaligner/With full field proximity exposure of very thick resist layers, the EVG6200 Infinity Automated Mask Alignment System targets wafer bumping and chip scale packaging markets as well as applications in MEMS, Compound Semiconductor, Power Devices and Nanotechnology.9/23/2010 1:06:59 PMKinz LisaSection19http://www.evgroup.com/de/products/bonding/waferbonding/evg520is/The EVG520IS Semi-automated Wafer Bonding System is configurable for all wafer bonding processes such as anodic, thermo compression, fusion bonding, or LowTemp plasma bonding.9/23/2010 1:05:51 PMKinz LisaSection20http://www.evgroup.com/de/products/bonding/integrated_bonding/8/19/2010 11:14:34 AMKinz LisaSection