http://www.evgroup.com/feeds/productsEVG Products1http://www.evgroup.com/en/products/lithography/nil_systems/iqaligneruvnil/The IQ Aligner Automated UV-NIL, µ-CP System allows for micromolding and nanoimprinting processes with stamps and wafers from 150 mm to 300mm diameter,3/27/2012 1:47:45 PMKinz LisaSection2http://www.evgroup.com/en/products/bonding/bondalignment/evg610/The EVG610 Semi-automated Bond Alignment System is designed for wafer-to-wafer alignment for subsequent wafer bonding applications.3/23/2012 9:33:51 AMSteininger JudithSection3http://www.evgroup.com/en/products/lithography/mask_aligners/evg620hbl_gen2/Dedicated, fully automated mask aligner system for high volume manufacturing of High-Brightness LEDs (HB-LEDs), compound semiconductors and power electronics.3/19/2012 12:27:08 PMSteininger JudithSection4http://www.evgroup.com/en/products/bonding/temporary_bonding/zonebond/The EVG805 is a semi-automated system for debonding thin wafers from sapphire, quartz or silicon carriers.3/12/2012 11:29:25 AMSteininger JudithSection5http://www.evgroup.com/en/products/bonding/soi_bonding/evg301/The EVG300 series single wafer cleaning systems are designed for efficient removal of particles. In semiconductor processing, efficient cleaning and particles removal prior to critical process steps enables maximum yield.3/8/2012 7:44:28 AMKinz LisaSection6http://www.evgroup.com/en/products/bonding/temporary_bonding/xtframe/2/21/2012 11:00:36 AMSteininger JudithSection7http://www.evgroup.com/en/products/lithography/12/28/2011 4:50:14 PMSteininger JudithSection8http://www.evgroup.com/en/products/bonding/temporary_bonding/10/28/2011 9:16:15 AMSteininger JudithSection9http://www.evgroup.com/en/products/bonding/integrated_bonding/geminifb/EV Group's GEMINIFB provides a fully automated and integrated platform for wafer-to-wafer alignment and wafer bonding.10/11/2011 6:46:53 AMKinz LisaSection10http://www.evgroup.com/en/products/bonding/waferbonding/9/13/2011 9:23:31 AMHaslinger SiegfriedSection11http://www.evgroup.com/en/products/bonding/9/13/2011 9:18:52 AMHaslinger SiegfriedSection12http://www.evgroup.com/en/services/evg_application_lab/7/28/2011 2:57:14 PMSteininger JudithSection13http://www.evgroup.com/en/products/bonding/waferbonding/evg560hbl/The EVG560 HBL is a dedicated, fully automated wafer bonding system for High-Brightness LED (HB-LED) manufacturing.7/6/2011 3:16:28 PMSteininger JudithSection14http://www.evgroup.com/en/products/bonding/soi_bonding/3/16/2011 7:17:29 AMKinz LisaSection15http://www.evgroup.com/en/products/bonding/waferbonding/evg520l3/EVG®520L3 Semi-Automated High-Vacuum Wafer Bonding System10/19/2010 2:07:36 PMSteininger JudithSection16http://www.evgroup.com/en/products/bonding/waferbonding/evg540/The EVG540 is an automated single-chamber production bonder designed for pilot line and manufacturing as well as R&D for high volume manufacturing in Wafer Level Packaging, 3D-Interconnect and MEMS applications.10/19/2010 12:26:47 PMKinz LisaSection17http://www.evgroup.com/en/products/lithography/mask_aligners/evg6200nt/Known for its high level of automation and reliability, the EVG®6200NT Automated Mask Alignment System is designed for wafer-to-wafer alignment up to 200 mm wafer sizes.10/19/2010 12:26:09 PMKinz LisaSection18http://www.evgroup.com/en/products/bonding/integrated_bonding/gemini/EV Group's GEMINI provides a fully automated and integrated platform for wafer-to-wafer alignment and wafer bonding.10/18/2010 1:15:20 PMKinz LisaSection19http://www.evgroup.com/en/products/lithography/nil_systems/10/18/2010 12:41:24 PMKinz LisaSection20http://www.evgroup.com/en/products/bonding/waferbonding/evg520is/The EVG520IS is configurable for all wafer bonding processes such as anodic, thermo compression, fusion bonding, or LowTemp plasma bonding.9/23/2010 1:08:16 PMKinz LisaSection