http://www.evgroup.com/feeds/productsEVG Products1http://www.evgroup.com/en/products/lithography/12/28/2011 4:50:14 PMSteininger JudithSection2http://www.evgroup.com/en/products/bonding/temporary_bonding/xtframe/12/6/2011 10:41:46 AMSteininger JudithSection3http://www.evgroup.com/en/products/bonding/temporary_bonding/zonebond/The EVG805 is a semi-automated system for debonding thin wafers from sapphire, quartz or silicon carriers.11/28/2011 12:42:44 PMSteininger JudithSection4http://www.evgroup.com/en/products/bonding/temporary_bonding/10/28/2011 9:16:15 AMSteininger JudithSection5http://www.evgroup.com/en/products/bonding/integrated_bonding/geminifb/EV Group's GEMINIFB provides a fully automated and integrated platform for wafer-to-wafer alignment and wafer bonding.10/11/2011 6:46:53 AMKinz LisaSection6http://www.evgroup.com/en/products/bonding/waferbonding/9/13/2011 9:23:31 AMHaslinger SiegfriedSection7http://www.evgroup.com/en/products/bonding/9/13/2011 9:18:52 AMHaslinger SiegfriedSection8http://www.evgroup.com/en/services/evg_application_lab/7/28/2011 2:57:14 PMSteininger JudithSection9http://www.evgroup.com/en/products/bonding/waferbonding/evg560hbl/The EVG560 HBL is a dedicated, fully automated wafer bonding system for High-Brightness LED (HB-LED) manufacturing.7/6/2011 3:16:28 PMSteininger JudithSection10http://www.evgroup.com/en/products/bonding/soi_bonding/3/16/2011 7:17:29 AMKinz LisaSection11http://www.evgroup.com/en/products/lithography/mask_aligners/evg620hbl/Dedicated, fully automated mask aligner system for high volume manufacturing of High-Brightness LEDs (HB-LEDs), compound semiconductors and power electronics.2/23/2011 6:45:24 AMKinz LisaSection12http://www.evgroup.com/en/products/lithography/nil_systems/iqaligneruvnil/The IQ Aligner Automated UV-NIL, µ-CP System allows for micromolding and nanoimprinting processes with stamps and wafers from 150 mm to 300mm diameter,12/1/2010 2:27:01 PMKinz LisaSection13http://www.evgroup.com/en/products/bonding/waferbonding/evg520l3/EVG®520L3 Semi-Automated High-Vacuum Wafer Bonding System10/19/2010 2:07:36 PMSteininger JudithSection14http://www.evgroup.com/en/products/bonding/waferbonding/evg540/The EVG540 is an automated single-chamber production bonder designed for pilot line and manufacturing as well as R&D for high volume manufacturing in Wafer Level Packaging, 3D-Interconnect and MEMS applications.10/19/2010 12:26:47 PMKinz LisaSection15http://www.evgroup.com/en/products/lithography/mask_aligners/evg6200nt/Known for its high level of automation and reliability, the EVG®6200NT Automated Mask Alignment System is designed for wafer-to-wafer alignment up to 200 mm wafer sizes.10/19/2010 12:26:09 PMKinz LisaSection16http://www.evgroup.com/en/products/bonding/integrated_bonding/gemini/EV Group's GEMINI provides a fully automated and integrated platform for wafer-to-wafer alignment and wafer bonding.10/18/2010 1:15:20 PMKinz LisaSection17http://www.evgroup.com/en/products/lithography/nil_systems/10/18/2010 12:41:24 PMKinz LisaSection18http://www.evgroup.com/en/products/bonding/soi_bonding/evg301/The EVG300 series single wafer cleaning systems are designed for efficient removal of particles. In semiconductor processing, efficient cleaning and particles removal prior to critical process steps enables maximum yield.9/29/2010 7:36:48 AMKinz LisaSection19http://www.evgroup.com/en/products/bonding/waferbonding/evg520is/The EVG520IS is configurable for all wafer bonding processes such as anodic, thermo compression, fusion bonding, or LowTemp plasma bonding.9/23/2010 1:08:16 PMKinz LisaSection20http://www.evgroup.com/en/products/lithography/mask_aligners/evg6200maskaligner/With full field proximity exposure of very thick resist layers, the EVG6200 Infinity targets wafer bumping and chip scale packaging markets as well as applications in MEMS, Compound Semiconductor, Power Devices and Nanotechnology.9/23/2010 1:07:42 PMKinz LisaSection