http://www.evgroup.com/feeds/productsEVG Products1http://www.evgroup.com/en/products/bonding/waferbonding/3/5/2013 2:22:31 PMKinz LisaSection2http://www.evgroup.com/en/products/bonding/temporary_bonding/zonebond/The EVG805 is a semi-automated system for debonding thin wafers from sapphire, quartz or silicon carriers.1/17/2013 1:41:20 PMDoblmann KlausSection3http://www.evgroup.com/en/products/bonding/temporary_bonding/11/20/2012 1:13:48 PMDoblmann KlausSection4http://www.evgroup.com/en/products/bonding/waferbonding/evg520is/The EVG520IS is configurable for all wafer bonding processes such as anodic, thermo compression, fusion bonding, or LowTemp™ plasma bonding.9/17/2012 11:22:42 AMDoblmann KlausSection5http://www.evgroup.com/en/products/bonding/waferbonding/evg510semi/The EVG510 is configurable for all wafer bonding processes such as anodic, thermo compression, fusion bonding, or LowTemp™ plasma bonding.9/17/2012 11:22:11 AMDoblmann KlausSection6http://www.evgroup.com/en/products/bonding/soi_bonding/evg810/The EVG810LT LowTemp™ plasma activation system is a single chamber, stand-alone unit for SOI, MEMS, compound semiconductors and advanced substrate bonding.9/17/2012 11:13:20 AMDoblmann KlausSection7http://www.evgroup.com/en/products/bonding/soi_bonding/9/17/2012 11:12:19 AMDoblmann KlausSection8http://www.evgroup.com/en/services/evg_application_lab/8/24/2012 9:34:05 AMDoblmann KlausSection9http://www.evgroup.com/en/products/bonding/7/23/2012 9:34:10 AMDoblmann KlausSection10http://www.evgroup.com/en/products/lithography/mask_aligners/evg620hbl_gen2/Dedicated, fully automated mask aligner system for high volume manufacturing of High-Brightness LEDs (HB-LEDs), compound semiconductors and power electronics.7/17/2012 7:06:47 AMDoblmann KlausSection11http://www.evgroup.com/en/products/bonding/integrated_bonding/gemini/EV Group's GEMINI provides a fully automated and integrated platform for wafer-to-wafer alignment and wafer bonding.7/11/2012 7:50:22 AMKinz LisaSection12http://www.evgroup.com/en/products/bonding/bondalignment/smartviewnt/For wafer-to-wafer alignment via alignment keys in bond interface. 7/3/2012 12:21:21 PMDoblmann KlausSection13http://www.evgroup.com/en/products/bonding/bondalignment/smartview/The SmartView Aligner offers a proprietary method for micron level face-to-face wafer level alignment.7/3/2012 12:21:05 PMDoblmann KlausSection14http://www.evgroup.com/en/products/lithography/nil_systems/iqaligneruvnil/The IQ Aligner Automated UV-NIL, µ-CP System allows for micromolding and nanoimprinting processes with stamps and wafers from 150 mm to 300mm diameter,3/27/2012 1:47:45 PMKinz LisaSection15http://www.evgroup.com/en/products/bonding/bondalignment/evg610/The EVG610 Semi-automated Bond Alignment System is designed for wafer-to-wafer alignment for subsequent wafer bonding applications.3/23/2012 9:33:51 AMSteininger JudithSection16http://www.evgroup.com/en/products/bonding/soi_bonding/evg301/The EVG300 series single wafer cleaning systems are designed for efficient removal of particles. In semiconductor processing, efficient cleaning and particles removal prior to critical process steps enables maximum yield.3/8/2012 7:44:28 AMKinz LisaSection17http://www.evgroup.com/en/products/bonding/temporary_bonding/xtframe/2/21/2012 11:00:36 AMSteininger JudithSection18http://www.evgroup.com/en/products/lithography/12/28/2011 4:50:14 PMSteininger JudithSection19http://www.evgroup.com/en/products/bonding/integrated_bonding/geminifb/EV Group's GEMINIFB provides a fully automated and integrated platform for wafer-to-wafer alignment and wafer bonding.10/11/2011 6:46:53 AMKinz LisaSection20http://www.evgroup.com/en/products/bonding/waferbonding/evg560hbl/The EVG560 HBL is a dedicated, fully automated wafer bonding system for High-Brightness LED (HB-LED) manufacturing.7/6/2011 3:16:28 PMSteininger JudithSection