EVG Latest News

EV Group Capitalizes on MEMS Market Leadership, Further Diversifies Business with Key 3D IC and LED Manufacturing Technology Advances

Kinz Lisa — 7/14/2010 5:55:10 AM

SEMICON WEST, San Francisco, July 13, 2010 – EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced it has received an order for its EVG520IS semi-automated wafer bonding system and EVG620TB mask and bond aligner from the University of Texas at Arlington (UTA).

EV Group Introduces Industry's First Fully Automated Wafer Bonding System for High-Brightness LED Manufacturing

Kinz Lisa — 7/13/2010 5:53:45 AM

ST. FLORIAN, Austria, July 12, 2010 - EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced that it has introduced the EVG560HBL wafer bonder-the industry's first fully automated wafer bonding system for high-brightness light emitting diode (HB-LED) manufacturing.

EV Group and the Institute of Microelectronics in Singapore Partner to Advance Through-Silicon Via Process Development for 3D IC Integration

Steininger Judith — 7/8/2010 1:05:16 PM

St. Florian, AUSTRIA and SINGAPORE, July 8, 2010– EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, and the Institute of Microelectronics (IME), a research institute of the Agency for Science, Technology and Research (A*STAR), today announced that they have entered into a two-year cooperation agreement to advance 3D IC integration technologies.

EV Group Introduces New EVG610 Mask and Bond Aligner Optimized for Greater Cost and Process Flexibility

Kinz Lisa — 7/7/2010 1:02:24 PM

ST. FLORIAN, AUSTRIA, July 6, 2010 - EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced that it has introduced the EVG610 mask and bond aligner, specifically to address its university and research customers' demands for a lower costing system with greater process versatility.

Fraunhofer IZM-ASSID selects EV Group Temporary Bonding and Debonding Equipment for Devoloping Processes for High-Volume Manufacturing of 3D ICS

Kinz Lisa — 5/31/2010 6:22:32 AM

ST. FLORIAN, Austria, May 31, 2010 - EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced that world-renowned research institute, Fraunhofer IZM-ASSID, has placed an order for two EVG temporary bonding and debonding (TB/DB) systems for thin-wafer handling and processing for 3D ICs.

University of Michigan's Lurie Nanofabrication Facility selects EV Group Wafer Bonding Systems for advanced MEMS research

Kinz Lisa — 3/2/2010 8:12:36 AM

ST. FLORIAN, AUSTRIA, March 2, 2010 - EV Group (EVG) today announced that it has shipped two wafer bonding systems to the University of Michigan's Lurie Nanofabrication Facility (LNF) - a leading center for MEMS and microsystems research and an integral member of the National Nanotechnology Infrastructure Network (NNIN), which is supported by the National Science Foundation.

Wafer-Level Camera Manufacturer, Nemotek Technologie, selects EV Group Wafer Bonding and UV Nanoimprint Lithography Systems for Capacity Ramp

Kinz Lisa — 3/30/2010 12:01:47 PM

ST. FLORIAN, AUSTRIA, March 30, 2010 - EV Group (EVG) today announced that Morocco-based wafer-level camera manufacturer Nemotek Technologie has placed a repeat order for EVG’s bonding and UV nanoimprint lithography (UV-NIL) systems – the EVG520IS and IQ Aligner.

EV Group installs fusion Wafer Bonding Systems at two leading CMOS image sensor manufacturing facilities in Asia

Kinz Lisa — 10/6/2009 7:47:36 AM

SEMICON Europa 2009, October 6, 2009 – EV Group (EVG) today announced that it has completed the installation of two automated fusion bonding systems for 300-mm wafers at a leading semiconductor foundry and at a major consumer electronics manufacturer.

NILCOM consortium to highlight latest developments at nano tech 2010

Steininger Judith — 2/9/2010 4:20:36 PM

NANO TECH 2010-TOKYO, JAPAN, February 9, 2010 - NILCom, a nanoimprint lithography consortium comprising companies and research organizations throughout the imprint lithography supply chain, will be exhibiting at nano tech 2010 held February 17-19 in Tokyo, Japan.

SEMEFAB broadens diverse process portfolio with the installation of an EVG520IS Wafer Bonding System

Schütte Clemens — 11/6/2009 11:43:20 AM

GLENROTHES, SCOTLAND, UK, November 5, 2009 - Semefab (Scotland) Ltd, a leading, independent wafer fab foundry, today announced that it will further broaden its diverse process portfolio with the installation of a wafer bonding system from EV Group.