EVG Latest News

EV Group Signs Collaboration Agreement with Eulitha to Establish Low-Cost-of-Ownership Nanopatterning Solutions for HB-LED Manufacturing

Kinz Lisa — 1/10/2012 2:17:43 PM

ST. FLORIAN, Austria, January 10, 2012 - EV Group (EVG) today announced that it has signed a joint-development and licensing agreement with Eulitha AG, a pioneer and leader in the production of high-quality nanostructures using advanced lithography techniques. EVG will integrate Eulitha's PHABLE™ mask-based ultraviolet (UV) photolithography technology with EVG's automated mask aligner product platform.

EV Group Launches Second-Generation EVG620HBL Mask Alignment System for LED Manufacturing

Kinz Lisa — 2/7/2012 1:53:39 PM

STRATEGIES IN LIGHT, Santa Clara, Calif., February 7, 2012 – EV Group (EVG), a leading supplier of wafer-bonding and lithography equipment for the advanced semiconductor and packaging, compound semiconductors, MEMS, silicon-on-insulator (SOI) and emerging nanotechnology markets, today announced the EVG620HBL Gen II—the second generation fully automated mask alignment system for volume manufacturing of high-brightness light-emitting diodes (HB-LEDs).

Tokyo Institute of Technology Installs EV Group Wafer Cleaning System for Advanced Optical IC Research and Development

Kinz Lisa — 3/1/2012 1:16:45 PM

TOKYO, Japan, March 1, 2012 - EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced that it has shipped an EVG301 semi-automated single-wafer cleaning system to Tokyo Institute of Technology (Tokyo Tech). The EVG301 has already been installed at Tokyo Tech's Arai-Nishiyama Lab, and is being used in the research and development of advanced optical communication ICs.

Shin-Etsu MicroSi Joins EV Group's Open Platform for Temporary Bonding Materials for 3D IC Manufacturing

Kinz Lisa — 3/14/2012 2:01:01 PM

ST. FLORIAN, Austria and TOKYO, Japan, March 14, 2012 - EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced that Shin-Etsu Chemical Co., Ltd., the world's largest supplier of semiconductor materials, has joined EVG's open platform for temporary bonding/debonding (TB/DB) materials.

Himax Technologies Selects EV Group to Expand Production Capacity for Wafer-Level Optics

Kinz Lisa — 3/27/2012 1:38:35 PM

ST. FLORIAN, AUSTRIA, March 27, 2012 - EV Group (EVG) today announced that Himax Technologies, Inc., a leading producer of CMOS image sensors, power management devices and semiconductor devices and components used in flat panel displays, has placed a repeat order for an IQ Aligner UV nanoimprint lithography (UV-NIL) system from EVG.

Brewer Science and EV Group Announce Agreement on ZoneBOND™ Technology

Steininger Judith — 10/20/2011 12:18:08 PM

ROLLA, MO, USA and ST. FLORIAN, AUSTRIA, October 20, 2011 - Brewer Science, Inc., a global leading innovator and manufacturer of specialty materials, process solutions, and equipment for the microelectronics industry, and EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology, and semiconductor markets, today announced an agreement on ZoneBOND™ technology.

EV Group Launches ZoneBOND™ Capable Equipment and Open Platform for Temporary Bonding Materials

Steininger Judith — 10/27/2011 6:33:47 AM

ST. FLORIAN, Austria, October 26, 2011- EV Group (EVG) today announced that it has launched a suite of groundbreaking temporary bonding and debonding (TB/DB) equipment modules that support ZoneBOND™ technology. In parallel, EVG has opened its TB/DB equipment platform to enable the use of a wide range of adhesives from various suppliers to give customers the most flexible choice of bonding materials.

EV Group Boosts High-Volume Manufacturing Performance across Product Lines with New XT Frame Equipment Platform

Steininger Judith — 12/5/2011 2:29:03 PM

ST. FLORIAN, Austria, December 6, 2012 - EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced it has introduced a new equipment platform, dubbed the XT Frame, that extends process throughput and tool functionality for virtually all of its current volume-manufacturing product offerings.

Asahi Kasei Orders IQ Aligner UV-NIL System from EV Group for Advanced Materials Development for High-Resolution Wafer-Level Optics

Kinz Lisa — 12/6/2011 2:40:16 PM

SEMICON JAPAN, CHIBA CITY, Japan, December 6, 2011 - EV Group (EVG) today announced that Asahi Kasei E-Materials Corporation, the core operating company of the Asahi Kasei Group for electronics materials, energy materials, photosensitive materials and epoxy resins, has purchased an IQ Aligner UV nanoimprint lithography (UV-NIL) system from EVG.

EV Group Launches New Flagship Model in its GEMINI® FB Family of Fusion Wafer Bonding Systems to Enhance Throughput and Automation Performance

Steininger Judith — 9/7/2011 1:54:11 PM

ST. FLORIAN, Austria, Sept. 7, 2011 - EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced that it is launching a new flagship model in its field-proven GEMINI FB fusion wafer bonding family that increases system throughput to up to 20 wafers per hour.