EVG Latest News

EV Group Launches Second-Generation EVG620HBL Mask Alignment System for LED Manufacturing

Kinz Lisa — 2/7/2012 1:53:39 PM

STRATEGIES IN LIGHT, Santa Clara, Calif., February 7, 2012 – EV Group (EVG), a leading supplier of wafer-bonding and lithography equipment for the advanced semiconductor and packaging, compound semiconductors, MEMS, silicon-on-insulator (SOI) and emerging nanotechnology markets, today announced the EVG620HBL Gen II—the second generation fully automated mask alignment system for volume manufacturing of high-brightness light-emitting diodes (HB-LEDs).

EV Group Boosts High-Volume Manufacturing Performance across Product Lines with New XT Frame Equipment Platform

Steininger Judith — 12/5/2011 2:29:03 PM

ST. FLORIAN, Austria, December 6, 2012 - EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced it has introduced a new equipment platform, dubbed the XT Frame, that extends process throughput and tool functionality for virtually all of its current volume-manufacturing product offerings.

EV Group Signs Collaboration Agreement with Eulitha to Establish Low-Cost-of-Ownership Nanopatterning Solutions for HB-LED Manufacturing

Kinz Lisa — 1/10/2012 2:17:43 PM

ST. FLORIAN, Austria, January 10, 2012 - EV Group (EVG) today announced that it has signed a joint-development and licensing agreement with Eulitha AG, a pioneer and leader in the production of high-quality nanostructures using advanced lithography techniques. EVG will integrate Eulitha's PHABLE™ mask-based ultraviolet (UV) photolithography technology with EVG's automated mask aligner product platform.

Asahi Kasei Orders IQ Aligner UV-NIL System from EV Group for Advanced Materials Development for High-Resolution Wafer-Level Optics

Kinz Lisa — 12/6/2011 2:40:16 PM

SEMICON JAPAN, CHIBA CITY, Japan, December 6, 2011 - EV Group (EVG) today announced that Asahi Kasei E-Materials Corporation, the core operating company of the Asahi Kasei Group for electronics materials, energy materials, photosensitive materials and epoxy resins, has purchased an IQ Aligner UV nanoimprint lithography (UV-NIL) system from EVG.

EV Group Launches New Flagship Model in its GEMINI® FB Family of Fusion Wafer Bonding Systems to Enhance Throughput and Automation Performance

Steininger Judith — 9/7/2011 1:54:11 PM

ST. FLORIAN, Austria, Sept. 7, 2011 - EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced that it is launching a new flagship model in its field-proven GEMINI FB fusion wafer bonding family that increases system throughput to up to 20 wafers per hour.

EV Group Secures Multiple System Order from Colibrys for Production of MEMS-based Motion Sensors

Haslinger Siegfried — 9/10/2008 11:41:02 AM

February 21, 2008 - EV Group today announced that it has received a multiple system order from Colibrys, a world-leading supplier of standard and custom MEMS-based motion sensors for harsh-environment and safety critical applications.

Shanghai Simgui Technology Places Follow-on Order for EVG Wafer Bonder; Advances to Fully Automated SOI Wafer Production

Kinz Lisa — 11/8/2011 1:35:26 PM

ST. FLORIAN, Austria, November 8, 2011 - EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced that Shanghai Simgui Technology Co., Ltd. (Simgui), a leading Chinese wafer manufacturer, has placed a follow-on order for an EVG850 automated production bonding system for silicon-on-insulator (SOI) and direct wafer bonding.

EV Group Launches ZoneBOND™ Capable Equipment and Open Platform for Temporary Bonding Materials

Kinz Lisa — 10/27/2011 6:33:47 AM

ST. FLORIAN, Austria, October 26, 2011- EV Group (EVG) today announced that it has launched a suite of groundbreaking temporary bonding and debonding (TB/DB) equipment modules that support ZoneBOND™ technology. In parallel, EVG has opened its TB/DB equipment platform to enable the use of a wide range of adhesives from various suppliers to give customers the most flexible choice of bonding materials.

Brewer Science and EV Group Announce Agreement on ZoneBOND™ Technology

Kinz Lisa — 10/20/2011 12:18:08 PM

ROLLA, MO, USA and ST. FLORIAN, AUSTRIA, October 20, 2011 - Brewer Science, Inc., a global leading innovator and manufacturer of specialty materials, process solutions, and equipment for the microelectronics industry, and EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology, and semiconductor markets, today announced an agreement on ZoneBOND™ technology.

EV Group and Fraunhofer IZM-ASSID Establish Joint Development Agreement for High-Volume 3D Integration Applications

Kinz Lisa — 10/11/2011 6:04:16 AM

SEMICON EUROPA, Dresden, Germany, October 11, 2011-EV Group (EVG) today announced that it has established an agreement with world-renowned research institute Fraunhofer IZM-ASSID to jointly develop high-volume manufacturing processes for 3D IC integration applications.