EVG Latest News

EV Group Rolls Out Next-Generation EVG120 Automated Resist Processing System for Micro- and Nano-Electronics Production

Kinz Lisa — 5/7/2013 11:48:38 AM

SEMICON SINGAPORE, May 7, 2013-EV Group (EVG) today introduced the latest version of its EVG®120 automated resist processing system. Incorporating new features and improved productivity in an ultra-small footprint design, the EVG120 system supports coating and developing applications for a variety of markets, including microelectromechanical systems (MEMS), advanced packaging and compound semiconductors.

EV Group Ships 300mm Wafer Bonding System to Leading Chinese Semiconductor Foundry for 3D-IC and Advanced Packaging Volume Production Applications

Kinz Lisa — 3/13/2013 1:36:31 PM

ST. FLORIAN, Austria, March 13, 2013 - EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced that it has installed a fully automated 300-mm system from EVG's Gemini® product family of integrated wafer bonding clusters to a leading Chinese semiconductor foundry. This customer will use the system for 3D IC integration and advanced packaging-two high-volume applications for which EVG's wafer bonding solutions have become the de facto industry standard.

EV Group Extends Wafer Bonding Equipment and Process Solutions for Covalent Bonding Technology

Kinz Lisa — 3/5/2013 1:59:15 PM

ST. FLORIAN, Austria, March 5, 2013 - EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced that it is developing equipment and process technology to enable covalent bonds at room temperature. This breakthrough technology will be available on a new equipment platform, called EVG580® ComBond®, which will include process modules that are designed to perform surface preparation processes on both semiconductor materials and metals.

China-based SOI Wafer manufacturer Shenyang Silicon Technology purchases EV Group's EVG850LT 300-mm SOI Production Bonding System

Kinz Lisa — 10/9/2012 6:35:08 AM

ST. FLORIAN, Austria, October 9, 2012—EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced that Shenyang Silicon Technology Co. Ltd. (SST) has successfully installed an EVG850LT 300-mm, lowtemperature automated production bonding system for silicon-on-insulator (SOI) materials. The China-U.S. joint-venture SOI wafer provider selected the 300-mm bonder as a follow-on to its prior purchase of a 200-mm EVG850LT. The system has already shipped to SST’s state-of-the-art facility, marking the first installation in China of a 300-mm SOI wafer production tool.

EV Group Completes Cleanroom Expansion, Opens New R&D Labs and Customer Training Center at Corporate Headquarters

Kinz Lisa — 11/27/2012 1:31:33 PM

ST. FLORIAN, Austria, November 27, 2012 - EV Group (EVG) announced the completion of its newly expanded cleanroom IV facility at its corporate headquarters in Austria. As part of the company's long-term growth strategy to address high-volume tool orders and speed time to market for its worldwide customer base, EV Group doubled its cleanroom space for process development and pilot production services.

Texas State University Selects EV Group Wafer Bonding System for Advanced Compound Semiconductor and Silicon-Based Power Device Research

Kinz Lisa — 11/13/2012 1:19:09 PM

ST. FLORIAN, Austria and SAN MARCOS, Texas, U.S., November 13, 2012 - EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced it has installed an EVG501 wafer bonding system to Texas State University. The highly flexible R&D system, which is configurable for a variety of wafer bonding processes, has been installed in the university's cleanroom facilities to support advanced compound semiconductor and silicon-based power device research and development.

EV Group Commands Leadership Position in MEMS Market

Kinz Lisa — 11/6/2012 3:28:13 PM

TEMPE, Ariz., November 6, 2012 - EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today highlighted a succession of milestones in the MEMS arena, where the company continues to strengthen its market share. In 2012, MEMS represented 48 percent of the company's North American sales, up 13 percent from 2011, thanks to strong growth in the mobile device and automotive sensor markets.

How EV Group jumped to 4th place

Kinz Lisa — 10/8/2012 8:32:26 AM

SANTA CLARA, CA, October 8, 2012 - 2012 was the first time EV Group (EVG), a wafer bonding and lithography equipment supplier, captured a top five spot in VLSIresearch's 2012 Customer Satisfaction Survey. This was a significant accomplishment because EVG has been growing by leaps and bounds with a combination of excellent products and the fast-growing MEMS and 3D IC semiconductor markets. EVG grew not only in revenues, but they also doubled their production capacity.

EV Group's ZoneBOND® Temporary Bonding/Debonding Technology Makes First Foray Into Compound Semiconductor Market

Kinz Lisa — 9/24/2012 1:10:22 PM

ST. FLORIAN, Austria, September 24, 2012 - EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced it has received an order for its EVG850 temporary bonding/debonding (TB/DB) systems from a leading maker of compound semiconductor-based components.

EV Group Unveils Its Next-Generation EVG150 Automated Resist Processing Platform for High-Volume Coating/Developing Applications

Kinz Lisa — 9/4/2012 12:50:54 PM

SEMICON TAIWAN, Taipei, September 5, 2012 - EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today unveiled its next-generation EVG150 automated resist processing system. The high-volume coater/developer has been completely redesigned to provide customers with a flexible, modular platform that integrates spin coating and developing with EVG's advanced, proprietary spray coating technology.