EVG40 Top-to-Bottom Side Aligment Accuracy Measurement System

Features:

• Non-destructive, visible light, self calibrating technology
• Repeatable top-to-bottom side alignment accuracy measurement
• Any wafer or substrate material up to 200 mm
• High power objectives from 5x to 50x
• Absolute accuracy < 0.5 µm with a statistical probability of 99%
• PC-based measurement system
• Manual to fully-automated versions

Basic Configurations:

EVG40 Standard

Basic Unit:

• Alignment Stage
• Optics

EVG40 Advanced

Basic Unit:

• Alignment Stage
• Optics

Advanced Features:

• Image Recognition System
• Quick Transparent Overlay
• Linewidth Measurement Mode

EVG40 Semi-Automated

Basic Unit:

• Alignment Stage
• Optics

Advanced Features:

• Image Recognition System
• Quick Transparent Overlay
• Linewidth Measurement Mode

Automation Features:

• Programmable Microscope Stage
• Rack
• Motorized Chuck Rotation
• Field-upgradeable to EVG40 AUTOMATED

EVG40 Fully-Automated

Basic Unit:

• Alignment Stage
• Optics

Advanced Features:

• Image Recognition System
• Quick Transparent Overlay
• Linewidth Measurement Mode

Automation Features:

• Programmable Microscope Stage
• Rack
• Motorized Chuck Rotation
• Robotic Autoload Cassette-to-Cassette

Click here for further information on EV Group's inspection systems.