Wafer Level Optics

Wafer level cameras (WLCs) are devices in which all the individual parts are fabricated at wafer level and are then bonded to form one single part consisting of a CMOS image sensor (CIS) and a micro-optics stack enhancing the light capture efficiency of the camera.

UV imprint lithography, originally developed for cost-efficient replication of structures in the nanometer range, is now considered a powerful tool for the fabrication of wafer-level optics in highly parallel mass fabrication processes.

EV Group offers manufacturers a complete range of solutions, including master stamp fabrication, replication and integration of optical elements at wafer level based on its well-established mask alignment and nanoimprint lithography systems. Its product portfolio is highly versatile, enabling customers to implement highly customized hardware and software processes. Coupled with process development and optimization in EV Group's cleanroom facilities, EV Group provides a total solution from system configuration and fabrication to process integration and material know-how.

Polymeric microlenses on a glass wafer fabricated by UV Imprint Lithography. Source: EVG.


Cross section of wafer level camera module consisting of a CMOS image sensor, double side lens wafers and spacer wafers. Source EVG.