Wafer Level Optics
 Related Products

Lithography

   

EVG®101 Advanced Resist Processing System

The EVG101 series perform R&D type processes on a single chamber design, which is fully compatible with our automated systems.

   

EVG®101 Large Area Coating System

The EVG101LA large area coating system is designed for cost effective coating on large areas.

   

EVG®105 Bake Module

Designed for softbake, post-exposure bake and hardbake processes.

   

EVG®120 Automated Resist Processing System

The EVG120 is an economical tool for quality spin coating and develop processes, especially for standard photoresist applications.

   

EVG®150 Automated Resist Processing System

Designed to provide the widest range of process variations, the EVG150 series' modularity accepts spin and spray coating, developing, bake and chill modules to suit your individual production requirements.

   

EVG®40 Top-to-bottom side Measurement System

EV Group offers systems for highly accurate destruction-free alignment accuracy measurements designed for all processes that involve double sided lithography.

   

EVG®620 Automated Mask Alignment System

Automated Mask Alignment System designed for optical double-side lithography. Volume production types and manual R&D systems are available.

   

EVG®6200∞ Automated Mask Alignment System

With full field proximity exposure of very thick resist layers, the EVG6200 Infinity targets wafer bumping and chip scale packaging markets as well as applications in MEMS, Compound Semiconductor, Power Devices and Nanotechnology.

   

EVG®770 Automated NIL Stepper

EV Group's NIL Stepper is designed for step and repeat large area UV-Nanoimprint Lithography (UV-NIL) processes compatible for 100 mm up to 300 mm wafers.

   

IQ Aligner® Automated Mask Alignment System

The IQ Aligner Automated Mask Alignment System is based on a field-proven, robust design with up to 300 mm wafer size capability, full-field exposure, single and double-side alignment, large gap and dark field mask alignment.

   

NanoSpray™ Technology

EVG's NanoSpray™ Coating Technology enables a new bandwidth of applications throughout many technologies in semiconductor processing markets.

Bonding

   

EVG®40NT Automated Measurement System

EV Group offers systems for highly accurate destruction-free alignment accuracy measurements designed for all processes that involve double sided lithography.

   

GEMINI® Automated Production Wafer Bonding System

EV Group's GEMINI provides a fully automated and integrated platform for wafer-to-wafer alignment and wafer bonding.

   

SmartView® Bond Alignment System for Universal Alignment

The SmartView Aligner offers a proprietary method for micron level face-to-face wafer level alignment.

   

SmartView®NT Bond Alignment System for Universal Alignment

For wafer-to-wafer alignment via alignment keys in bond interface.