Go to the main navigation
Go to content

SAW Devices
Related Products

Bonding

EVG®501 Wafer Bonding System

The EVG501 is a highly flexible R&D system that can handle small substrate pieces up to 200 mm wafers.

EVG®510 Semi-automated Wafer Bonding System

The EVG510 is configurable for all wafer bonding processes such as anodic, thermo compression, fusion bonding, or LowTemp™ plasma bonding.

EVG®520IS Semi-automated Wafer Bonding System

The EVG520IS is configurable for all wafer bonding processes such as anodic, thermo compression, fusion bonding, or LowTemp™ plasma bonding.

EVG®540 Automated Wafer Bonding System

The EVG540 is an automated single-chamber production bonder designed for pilot line and manufacturing as well as R&D for high volume manufacturing in Wafer Level Packaging, 3D-Interconnect and MEMS applications.

EVG®560 Automated Wafer Bonding System

The EVG560 accepts up to four bond chambers with various bond chamber configuration options for all bonding processes and wafers up to 300 mm.

Solutions

News and Events

VLSIresearch announces winners of the 2013 10 BEST Suppliers of Chip Making Equipment awards

EV Group Rolls Out Next-Generation EVG120 Automated Resist Processing System

sensors expo & conference 2013

TBDB_AD_Feb_13

See Also

Related Products

Compound Semiconductor and Silicon-Based Power Devices

Technical Papers

EV Group Corporate Video

3D InCites reports on EVG Headquarters expansion and technology developments

References

Semiconductor 3-D Equipment and Materials Consortium
EVG is member of the EMC-3D consortium, created for the development of cost-effective 3D TSV (Through-Silicon-Via) interconnect