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Lithography

EVG®510HE Semi-automated Hot Embossing System

EV Group's EVG510HE is designed for hot embossing applications of polymer substrates and spin-on polymers with excellent pattern fidelity.

EVG®520HE Semi-Automated Hot Embossing System

EV Group's EVG520HE is designed for hot embossing applications of polymer substrates and spin-on polymers with excellent pattern fidelity."

EVG®620 Automated UV-NIL, µ-CP System

The EVG620 Automated UV-NIL, µ-CP System allows for imprint processes with stamps to substrates ranging from small chip size pieces up to 150 mm in diameter.

EVG®6200∞ Automated UV-NIL, µ-CP System

The EVG6200 Automated UV-NIL, µ-CP System is designed for For pattern creation in UV-curable materials from a prestructured stamp to a substrate.

EVG®750 Automated Hot Embossing System

EV Group's EVG750 is designed for hot embossing applications of polymer substrates and spin-on polymers with excellent pattern fidelity.

EVG®770 Automated NIL Stepper

EV Group's NIL Stepper is designed for step and repeat large area UV-Nanoimprint Lithography (UV-NIL) processes compatible for 100 mm up to 300 mm wafers.

IQ Aligner® Automated UV-NIL, µ-CP System

The IQ Aligner Automated UV-NIL, µ-CP System allows for micromolding and nanoimprinting processes with stamps and wafers from 150 mm to 300mm diameter,

Bonding

EVG®520IS Semi-automated Wafer Bonding System

The EVG520IS is configurable for all wafer bonding processes such as anodic, thermo compression, fusion bonding, or LowTemp™ plasma bonding.

EVG®540 Automated Wafer Bonding System

The EVG540 is an automated single-chamber production bonder designed for pilot line and manufacturing as well as R&D for high volume manufacturing in Wafer Level Packaging, 3D-Interconnect and MEMS applications.

EVG®560 Automated Wafer Bonding System

The EVG560 accepts up to four bond chambers with various bond chamber configuration options for all bonding processes and wafers up to 300 mm.

EVG®820 Lamination System

The EVG820 Lamination System is used for automated, stress-free lamination of any kind of dry adhesive film onto the carrier wafer.

Bonding

Lithography

Solutions

News and Events

EV Group Rolls Out Next-Generation EVG120 Automated Resist Processing System

EV Group Ships 300mm Wafer Bonding System to Leading Chinese Semiconductor Foundry

sensors expo & conference 2013

TBDB_AD_Feb_13

See Also

Related Products

Advanced Packaging, 3D Interconnect

Technical Papers

EV Group Corporate Video

3D InCites reports on EVG Headquarters expansion and technology developments

References

Semiconductor 3-D Equipment and Materials Consortium
EVG is member of the EMC-3D consortium, created for the development of cost-effective 3D TSV (Through-Silicon-Via) interconnect