MEMS Devices

MEMS (micro electro mechanical systems) are miniaturized 3D devices consisting of microelectronic components (integrated circuits) and micromechanical, optical, chemical, biochemical, or micro-optical components. MEMS technology is a rapidly emerging field with a high-growth rate. Motion sensors, micro mirrors, microphones, gyroscopes, and accelerometers are just a few types of the MEMS devices that are found in consumer applications such as cell phones, television sets, digital cameras, gaming consoles and laptops.

The manufacturing process of MEMS devices includes proximity or contact lithography to generate micro machined mechanical features. With most device types a double side lithography step, in which the front side pattern needs to be precisely aligned to the back side, is required. EV Group offers lithography systems with special configurations to suit the MEMS manufacturing requirements.

Featuring moving components at a micron scale, many MEMS devices require silicon wafer bonding - for example silicon or glass bonding - as a method to hermetically seal and encapsulate the device in order to create a first-level package. The EV Group wafer bonding systems are designed for volume manufacturing of MEMS and perform all wafer bonding techniques utilizing EV Group's unique process separation principle. Modular configurations facilitate the transfer of R&D processes to production, and the equipment supports various wafer sizes and materials. EV Group's wafer bonding equipment achieves the highest yields for aligned wafer bonding in the industry.

MEMS Microphone. Courtesy of Akustika.