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Logic / Memory
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Lithography

EVG®150 Automated Resist Processing System

Designed to provide the widest range of process variations, the EVG150 series' modularity accepts spin and spray coating, developing, bake and chill modules to suit your individual production requirements.

EVG®150N Automated NanoSpray™ Coating System

EVG®150N Automated NanoSpray™ Coating System allows a new bandwidth of applications throughout many technologies in semiconductor processing markets.

EVG®40NT Automated Measurement System

EV Group offers systems for highly accurate destruction-free alignment accuracy measurements designed for all processes that involve double sided lithography.

Hercules® Lithography Track System

The Hercules is a unique platform with spin coat, bake, chill, align/expose and develop modules, all arranged in one production system.

IQ Aligner® Automated Mask Alignment System

The IQ Aligner Automated Mask Alignment System is based on a field-proven, robust design with up to 300 mm wafer size capability, full-field exposure, single and double-side alignment, large gap and dark field mask alignment.

IQ Aligner® Automated UV-NIL, µ-CP System

The IQ Aligner Automated UV-NIL, µ-CP System allows for micromolding and nanoimprinting processes with stamps and wafers from 150 mm to 300mm diameter,

Bonding

EVG®540 Automated Wafer Bonding System

The EVG540 is an automated single-chamber production bonder designed for pilot line and manufacturing as well as R&D for high volume manufacturing in Wafer Level Packaging, 3D-Interconnect and MEMS applications.

EVG®540C2W Automated Wafer & Chip-to-Wafer Bonding System

The EVG540C2W is designed for permanent bonding on chips to wafer (C2W) on wafer scale.

EVG®560 Automated Wafer Bonding System

The EVG560 accepts up to four bond chambers with various bond chamber configuration options for all bonding processes and wafers up to 300 mm.

EVG®850 Automated Production Bonding System for SOI

The EVG850 is designed to fulfill a wide range of fusion wafer bonding applications, with main focus on SOI substrates manufacturing. The EVG850 is the only production bonding system built to operate in high throughput, high-yield environments.

EVG®850DB Automated Debonding System

The EVG850DB Automated Debonding System is designed for automated debonding of device wafer from the carrier substrate.

EVG®850TB Automated Temporary Bonding System

The EVG850TB bonds compound semiconductor wafers to sapphire, quartz or silicon carriers by use of dry film, spin-on adhesives, or wax.

GEMINI® Automated Production Wafer Bonding System

EV Group's GEMINI provides a fully automated and integrated platform for wafer-to-wafer alignment and wafer bonding.

GEMINIFB® Production Fusion Bonding System

EV Group's GEMINIFB provides a fully automated and integrated platform for wafer-to-wafer alignment and wafer bonding.

SmartView® Bond Alignment System for Universal Alignment

The SmartView Aligner offers a proprietary method for micron level face-to-face wafer level alignment.

SmartView®NT Bond Alignment System for Universal Alignment

For wafer-to-wafer alignment via alignment keys in bond interface.

Solutions

News and Events

EVG and Dynaloy Jointly Develop Single-Wafer Cleaning Solution

Fraunhofer ISE Teams up with EVG to Enable Direct Semiconductor Wafer Bonds

Photonics Festival 2013

intersolar North America 2013

TBDB_AD_Feb_13

See Also

Related Products

Advanced Packaging, 3D Interconnect

SOI & Engineered Substrates

Technical Papers

EV Group Corporate Video

3D InCites reports on EVG Headquarters expansion and technology developments

References

Semiconductor 3-D Equipment and Materials Consortium
EVG is member of the EMC-3D consortium, created for the development of cost-effective 3D TSV (Through-Silicon-Via) interconnect