• Go to the main navigation
  • Go to content

 
EV Group
login
t-shop

  • EVGroup.com>>
  • Services>>
  • Customer Support

Customer Support

Commitment without borders

We act globally. Our lithography, bonding and imprint equipment is designed for reliability, productivity and quality, without any limits. Our highly qualified employees are part of a worldwide network and react quickly and flexibly to customer requests and enquiries. We are always prepared for new challenges.

Field-Service On-site Visits

Technical Support

Call Center

Spare Parts

Product Improvements

Training

Extended Equipment

Warranty

Preventive Maintenance

Agreement

On-site Service Agreement


Services

  • Process Technology
  • Customer Support
    • Field-Service On-site Visits
    • Technical Support Call Center
    • Spare Parts
    • Product Improvements
    • Training
    • Extended Equipment Warranty
    • Preventive Maintenance Agreement
    • On-site Service Agreement
Advanced Product Search

News and Events

EV Group Launches Second-Generation EVG620HBL Mask Alignment System for LED Manufacturing

EV Group Signs Collaboration Agreement with Eulitha

more news ..

SEMICON Korea 2012

Strategies in Light 2012

more events ..


Promotional Links

EV Group Solutions Video for 3D ICs and TSVs

EV Group Corporate Video

EV Group Corporate Brochure

Product Range

See Also

Lithography

Bonding

Technical Papers

References

            FrostSullivan
Technology Innovation Award 2010

 
  • About
    • Overview
    • Vision/Mission
    • Awards & Certificates
    • Advertising
    • Events
      • EVG Technology Days and Workshops
    • History
    • News
      • News Archive 2011
      • News Archive 2010
      • News Archive 2009
      • News Archive 2008
      • News Archive 2007
    • Purchasing
      • Demands
        • Mechanics
        • Electronics
        • Pneumatics
        • Fluidics
        • Vaccuum
        • Optical
      • Purchasing Conditions
      • Requirements
      • Purchasing Portal
    • Representatives & Industry Organizations
    • Environmental Policy
  • Products
    • Overview
    • Lithography
      • Mask Alignment Systems
        • EVG®610
        • EVG®620
        • EVG®620HBL
        • EVG®620NT
        • EVG®6200∞
        • EVG®6200NT
        • IQ Aligner®
      • Resist Processing Systems
        • EVG®101
        • EVG®101LA
        • EVG®105
        • EVG®120
        • EVG®150
        • EVG®150N
      • Lithography Track Systems
        • Hercules®
      • Nanoimprint Lithography Systems (UV-NIL, µCP, HE)
        • EVG®620
        • EVG®6200∞
        • IQ Aligner®
        • EVG®770
        • EVG®510HE
        • EVG®520HE
        • EVG®750
      • Inspection Systems
        • EVG®40
        • EVG®40NT
    • Bonding
      • Wafer Bonding Systems
        • EVG®501
        • EVG®510
        • EVG®520IS
        • EVG®520L3
        • EVG®540
        • EVG®540C2W
        • EVG®560
        • EVG®560HBL
      • Bond Alignment Systems
        • EVG®620
        • EVG®6200∞
        • SmartView®
        • SmartView®NT
      • Integrated Bonding Systems
        • Gemini®
        • GeminiFB®
      • SOI Bonding Systems
        • EVG®301
        • EVG®320
        • EVG®810LT
        • EVG®850
      • Temporary Bonding and Debonding Systems
        • EVG®805
        • EVG®850TB
        • EVG®850DB
        • EVG®820
        • ZoneBOND(TM)
        • XT Frame Platform
      • Inspection Systems
        • EVG®20
        • EVG®40NT
    • Process Technology
  • Solutions
    • Overview
    • CMOS Image Sensors
      • Introduction
      • Backend Lithography
      • Glass Bonding
      • Oxide Bonding
    • High Brightness LEDs
      • Introduction
      • Layer Transfer
      • Imprint Lithography
      • Optical Lithography
      • Thin Wafer Handling
    • Microfluidics
      • Introduction
      • Hot Embossing
      • Wafer Level Bonding
    • Logic / Memory
      • Introduction
      • Backend Lithography
      • Wafer Level Bonding
      • C2W Bonding
      • Thin Wafer Handling
    • MEMS Devices
      • Introduction
      • Lithography
      • First Level Packaging
    • SAW Devices
      • Introduction
      • Wafer Level Bonding
    • SOI Wafers
      • Introduction
      • Cleaning
      • Plasma Activation
      • Oxide Bonding
    • Wafer Level Optics
      • Introduction
      • Imprint Lithography
      • UV Bonding
    • Photovoltaics
      • Introduction
      • Imprint Lithography
      • Micro Optics
      • Wafer Bonding
      • Thin PV Wafers
      • Spray Coating
      • Optical Lithography
  • Markets
    • Overview
    • Advanced Packaging, 3D Interconnect
    • Compound Semiconductor and Silicon-Based Power Devices
    • MEMS
    • Nanotechnology
    • SOI
  • Services
    • Overview
    • Process Technology
    • Customer Support
      • Field-Service On-site Visits
      • Technical Support Call Center
      • Spare Parts
      • Product Improvements
      • Training
        • Training Request
      • Extended Equipment Warranty
      • Preventive Maintenance Agreement
      • On-site Service Agreement
  • Careers
  • Contact us

 
© EV Group, ALL RIGHTS RESERVED