IQ Aligner® Automated Mask Alignment System

Optimized for contactless proximity processing at highest throughput. Most accurate print gap control and unmatched uptime are fully addressing HVM requirements.

 

  • Substrate / Wafer parameters:
    Size: 150mm, 200mm, 300mm; Thickness: 0.1 - 15mm
  • Mask parameters: Size: max. 14"x14"; Thickness: <13mm
  • General system configuration:
    System rack: standard; Vibration isolation: active
  • Alignment accuracy:
    Top side alignment: ± 0.5µm 3σ
    Bottom side alignment: Option / ± 0.75µm 3σ
    IR alignment: Option / substrate depending
    Large gap alignment: Option / ± 1µm 3σ
    Bond alignment: Option 
    NanoAlign: Standard
  • Alignment stage:
    Precision micrometers: Motorized
    Wedge compensation: Internal 0.5 - 100N contact force,
    proximity spacers (option), 100% contactless (option)
  • Exposure:
    Modes: Proximity, soft-, hard, and vacuum contact
    Resolution: <1µm in vacuum contact, </= 2µm in proximity
    Wave length: 200 - 240nm / 240 - 280nm / 280 - 350nm / 350 - 450nm, filters (option)
    Mercury arc lamp: 500 / 1000 / 5000W
    Nanoimprint lithography: Optional tools available for UV-Nanoimprint Lithography and micro contact printing to achieve sub 100nm features
  • Automatic alignment: Option
  • Handling system: 3 cassette stations (up to 200mm) or 2 FOUP load ports / 300 mm
  • Automatic mask loading: Option
  • SECS/GEM II: Option
  • Lithography Track System Hercules: up to 300 mm