EVG®620 Automated Mask Alignment System

Mask alignment systems designed for optical double-side lithography. Volume production types and manual R&D systems are available.

 

Known for its high level of automation and reliability, the EVG620 is a dual-use tool designed for optical double-side lithography and precision alignment up to 150 mm wafer sizes. Volume production types and manual R&D systems are available. An ultra-soft wedge compensation together with a computer controlled contact force between the mask and wafer ensures that both yield and mask lifetime are dramatically increased while production costs are lowered. The fully-automated EVG620 utilizes a cassette-to-cassette handling system to efficiently process wafers from 50 mm to 150 mm in diameter, regardless of their shape or thickness. The system safely handles thick, bowed or small diameter wafers. The EVG620 superior alignment stage design achieves highly accurate alignment and exposure results while maintaining high throughput.

Features

  • High resolution top and bottom side splitfield microscopes
  • Handling of multiple wafer sizes with quick change-over time
  • High degree of automation (multiple send/receive cassettes)
  • Manual substrate loading capability on automated system
  • Windows® based user interface
  • Options
    - Cassette-to-cassette handling system
    - Automatic alignment
    - Field upgradeable from manual to fully-automated version
    - NanoAlign® package for enhanced process capabilities
    - Thin or warped wafer handling
    - Nanoimprint lithography and micro contact printing
    - Bond alignment
    - Simulation software for mask aligner lithography process