EVG®620HBL Gen II Fully Automated Mask Alignment System for HB-LED

Dedicated, fully automated mask aligner system for high volume manufacturing of High-Brightness LEDs (HB-LEDs), compound semiconductors and power electronics.

 

  • Wafer diameter (Substrate size/mm): 50-150 mm
  • Substrate materials: AIN, ceramic, metal, sapphire, Si, SiC
  • Throughput:
    Up to 165 wafer/hour (aligned)
    Up to 220 wafer/hour (first print)
  • Top Side Live Alignment Accuracy: ± 1.0µm 3σ
  • Bottom Side Alignment Accuracy: Option / ± 1.25µm 3σ
  • Exposure processes : Proximity, Soft-, Hard- and Vacuum contact
  • Pattern resolution :
    ≤ 0.6 µm (Vacuum contact)
    ³ 2.0 µm (Proximity)
  • Footprint:  1.7 m2
  • Wafer cassette mapping: Standard
  • SECS II/GEM interface : Optional
  • Typical customer application:  LED high volume manufacturing