Mask Alignment System designed for optical double-side lithography. Volume production types and manual R&D systems are available.
Imec and EVG demonstrate for the first time 1.8µm pitch overlay accuracy for wafer bonding
EVG and NNFC announced results on improved transparent nanostructured anti-reflective coatings for next-gen displays
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CS International 2017
IMAPS Device Packaging 2017
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EV Group Wins Order for UV-NIL/Hot Embossing Systems from Fraunhofer ENAS
EV Group Corporate Video