Inspection Systems

EVG's metrology solutions for wafer inspection and measurement are optimized for lithography and all types of bonding applications. Customers can choose between integration of the metrology technology within fully-automated equipment, or stand-alone metrology systems serving multiple process steps.
EVG's metrology solutions are optimized to maximize our customers' production yields, featuring:

  • Adaptiveness for different metrology integrations (fully-automated or stand-alone) for highest flexibility. A multi-sensor measurement mount enables the use of different sets of sensor heads for changing measurement tasks.
  • Handling of various substrate types in regards to materials, size, shape, stress, bow/warp.
  • Control by active feedback loop on EVG's production tools and fully automated tuning of production parameters, including customized pass / fail decisions on the tool or via SECS/GEM interface.