NanoSpray™ Technology
 Related Markets

   

Advanced Packaging, 3D Interconnect

Wafer level packaging employs specific alignment and wafer bonding techniques as an enabling solution for stacking of wafers and three-dimensional integration of devices.

   

Compound Semiconductor and Silicon-Based Power Devices

Microelectronic applications fabricated out of compound semiconductors as well as silicon-based power devices basically require dedicated manufacturing technologies offered by EVG.

   

MEMS

Micro-Electro-Mechanical Systems (MEMS) is the integration of mechanical elements, sensors, actuators, and electronics on a common silicon substrate through microfabrication technology.

   

Nanotechnology

Nanoimprint Lithography (NIL) is one of the most promising and cost-effective new techniques for generating nanometer-scale-resolution patterns for a variety of commercial applications in BioMEMS, microfluidics, optics, patterned media and electronics.