NanoSpray™ allows a new bandwidth of applications throughout many technologies in semiconductor processing markets.
BrochuresPlease click the picture to download the brochure in PDF formatEVG100 Series Short Brochure.pdfTechnical PapersPlease click the titles to download the full papers in PDF formatInvestigating the use of spray-coating technology in MEMS applicationsAbstract: Fabricating the many different varieties of of microelectromechanical systems (MEMS) poses complex processing challenges, particularly in the lithography area. Since MEMS devices rely on mechanical elements, they incorporate three-dimensional microstructures....Microring resonators fabrication by BCB adhesive wafer bondingAbstract: Microring resonator devices are attractive for Wavelength Division Multiplexing (WDM) applications because of their inherent spectral characteristics. GaInAsP/InP microring resonator devices were fabricated using a vertical integration concept based on GaInAsP/InP-on-GaAs wafer-to-wafer bonding...Spray coating for MEMS, NEMS and Micro SystemsAbstract: In the semiconductor and MEMS industry there is a requirement for uniform resist layers over highly integrated device structures. To achieve a precise line width, it is required to develop a coating process in which there are no coating defects, high coating uniformity over structures, and little to no edge bead...
Advanced Packaging and 3D-IC Market driving strong growth for EV Group's automated 300-mm polymer adhesive wafer bonding systems
EV GROUP organizes Photonics Workshop in Conjunction with MICRO AND NANO ENGINEERING (MNE) Conference
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SEMICON Europa 2015
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EV Group Supplies 300-mm Equipment to STMicroelectronics
EV Group Corporate Video