NanoSpray™ Technology

NanoSpray™ allows a new bandwidth of applications throughout many technologies in semiconductor processing markets.

 

Brochures
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EVG100 Series Short Brochure.pdf



Technical Papers
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Investigating the use of spray-coating technology in MEMS applications
Abstract: Fabricating the many different varieties of of microelectromechanical systems (MEMS) poses complex processing challenges, particularly in the lithography area. Since MEMS devices rely on mechanical elements, they incorporate three-dimensional microstructures....



Microring resonators fabrication by BCB adhesive wafer bonding
Abstract: Microring resonator devices are attractive for Wavelength Division Multiplexing (WDM) applications because of their inherent spectral characteristics. GaInAsP/InP microring resonator devices were fabricated using a vertical integration concept based on GaInAsP/InP-on-GaAs wafer-to-wafer bonding...



Spray coating for MEMS, NEMS and Micro Systems
Abstract: In the semiconductor and MEMS industry there is a requirement for uniform resist layers over highly integrated device structures. To achieve a precise line width, it is required to develop a coating process in which there are no coating defects, high coating uniformity over structures, and little to no edge bead...