EVG®150 Automated Resist Processing System up to 300mm

Fully-automated coat/develop process and high-throughput performance.

 

Brochures
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EVG100 Series Short Brochure.pdf




Technical Papers
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Adhesive wafer bonding with photosensitive polymers for MEMS fabrication
Abstract: Adhesive wafer bonding is a technique that uses an intermediate layer (typically a polymer) for bonding two substrates. The main advantages of using this approach are: low temperature processing (maximum temperatures lower than 400°C), surface planarization and tolerance to particles contamination (the intermediate layer can incorporate particles with the diameter in the layer thickness range). The main bonding layers properties required by a large field of applications/designs can be summarized as: isotropic dielectric constants, good thermal stability, low Young’s modulus, and good adhesion to different substrates.
 

Adhesive Wafer Bonding With SU-8 Intermediate Layers For Micro-Fluidic Applications

Abstract: Recently adhesive wafer bonding using SU-8 has gained a lot of interest for micro-fluidic devices e.g. lab-on-chip applications. Due to its specific properties as well as the capability to pattern thin and thick layers accurately, SU-8 is an ideal candidate for micro-fluidic components like channels, reservoirs and valves, but also for micro-optical components...



Adhesive wafer bonding for MEMS applications
Abstract: Low temperature wafer bonding is a powerful technique for MEMS/MOEMS devices fabrication and packaging. Among the low temperature processes adhesive bonding focuses a high technological interest. Adhesive wafer bonding is a bonding approach using an intermediate layer for bonding (e.g. glass, polymers, resists, polyimides). The main advantages of this method are: surface planarization, encapsulation of structures on the wafer surface, particle compensation and decrease of annealing temperature after bonding....



Adhesive wafer bonding for wafer-level fabrication of microring resonators
Abstract: Adhesive wafer bonding for wafer-level fabrication of microring resonators Abstract: GaInAsP/InP passive microring resonator devices were successfully fabricated using a vertical integration concept with GaInAsP/InP-on-GaAs wafer bonding. BCB adhesive bonding has been identified as the preferred wafer bonding process. This paper reports results on the development of the wafer bonding and on the microring fabrication...



An ultra-thick positive photoresist for advanced electroplating applications

Abstract: Flip chip packaging has been adopted for microprocessors and high-performance logic for performance reasons. Over time, flip chip is increasingly being adopted by lower transistor count devices for cost savings as flip chip packaging reaches cost parity with wire bonding in many applications...



High-performance temporary adhesives for wafer bonding applications
Abstract: This paper reviews a high temperature–resistant spin-on adhesive platform and the equipment solution used to apply the adhesive to a wafer, temporarily bond the wafer to a carrier, and debond the thinned wafer in an automated high-throughput method. The focus of this paper is on the physical and chemical properties of the spin-on adhesive material that enable an automated process...



Investigating the use of spray-coating technology in MEMS applications
Abstract: Fabricating the many different varieties of of microelectromechanical systems (MEMS) poses complex processing challenges, particularly in the lithography area. Since MEMS devices rely on mechanical elements, they incorporate three-dimensional microstructures....



Microring resonators fabrication by BCB adhesive wafer bonding
Abstract: Microring resonator devices are attractive for Wavelength Division Multiplexing (WDM) applications because of their inherent spectral characteristics. GaInAsP/InP microring resonator devices were fabricated using a vertical integration concept based on GaInAsP/InP-on-GaAs wafer-to-wafer bonding...



Spray coating for MEMS, NEMS and Micro Systems
Abstract: In the semiconductor and MEMS industry there is a requirement for uniform resist layers over highly integrated device structures. To achieve a precise line width, it is required to develop a coating process in which there are no coating defects, high coating uniformity over structures, and little to no edge bead...



Ultra-thick lithography for advanced packaging and MEMS
Abstract: An ever increasing need exists for thick resist layers in the processing of MEMS and for advanced packaging.  Applications in the MEMS field include bulk micromachining, surface micromachining, and the actual creating of active device structures... 



Wafer level packaging on Cu/low-K, high density back-end integrated circuits
Abstract: The continuing scaling trend in microelectronic circuit technology has a significant impact on the different IC interconnection and packaging technologies. Wafer level packaging is a promising technology to meet future demands of increase performance for advanced integrated circuits with tighter pitch (higher feature density) higher I/O counts and Cu metallization with low-k dielectric layers...



Wafer-scale BCB resist-processing technologies for high density integration and electronic packaging
Abstract: IC performance is drastically limited by line-to-line capacity coupling and RC interconnect delay times resulted from the continuous increase in integration densities with 0.10µm line and space width approaches, as well from increased signal frequencies. The new achievements in terms of circuit lines shrinkage emphasize the need for the introduction of Cu and low-k dielectric materials...



3D interconnect through aligned wafer level bonding
Abstract: Wafer Level Packaging and 3-D Interconnect Technologies are driven by the increasing device density, functionality as well as the reduction of total packaging costs. Many devices such as PDAs, memory cards, smart cards and cellular phones utilize the resulting chip scale packages. Key enabling technologies for 3D Interconnect are high precision alignment and bonding systems and thick resist processing...



III-V wafer bonding technology for wafer-level fabrication of GaInAsP/InP microring resonators
Abstract: GaInAsP/InP passive microring resonator devices were successfully fabricated using a vertical integration conecpt with GaInAsP/InP-on-GaAs wafer bonding. BCB adhesive bonding has been identified as the preferred wafer bonding process. This paper reports results on the development of the wafer bonding and on the microring fabrication.